Abstract: A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves.

Abstract: A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves.

Abstract: A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves.

Abstract: A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves.

Abstract: A multi-channel optoelectronic device is configured to establish a redundant status link with a remote device. The optoelectronic device can transmit N transmit optical signals to the remote device over a plurality of transmit channels and receive N receive optical signals from the remote device over a plurality of receive channels. The optoelectronic device includes one or more spare transmit and receive channels. When used with a remote device having spare transmit and receive channels, each device can establish a status link with the other and use the status link to switch out transmit and/or receive channels to identify and permanently switch out the worst transmit and/or receive channels. Alternately, the device can interoperate with a non-status-link enabled remote device by determining that the remote device is not status-link enabled, transitioning to a low transmit power mode, and transmitting and receiving over a plurality of default transmit and receive channels.

Abstract: A multi-channel optoelectronic device is configured to establish a redundant status link with a remote device. The optoelectronic device can transmit N transmit optical signals to the remote device over a plurality of transmit channels and receive N receive optical signals from the remote device over a plurality of receive channels. The optoelectronic device includes one or more spare transmit and receive channels. When used with a remote device having spare transmit and receive channels, each device can establish a status link with the other and use the status link to switch out transmit and/or receive channels to identify and permanently switch out the worst transmit and/or receive channels. Alternately, the device can interoperate with a non-status-link enabled remote device by determining that the remote device is not status-link enabled, transitioning to a low transmit power mode, and transmitting and receiving over a plurality of default transmit and receive channels.

Abstract: A multi-channel optoelectronic device is configured to establish a redundant status link with a remote device. The optoelectronic device can transmit N transmit optical signals to the remote device over a plurality of transmit channels and receive N receive optical signals from the remote device over a plurality of receive channels. The optoelectronic device includes one or more spare transmit and receive channels. When used with a remote device having spare transmit and receive channels, each device can establish a status link with the other and use the status link to switch out transmit and/or receive channels to identify and permanently switch out the worst transmit and/or receive channels. Alternately, the device can interoperate with a non-status-link enabled remote device by determining that the remote device is not status-link enabled, transitioning to a low transmit power mode, and transmitting and receiving over a plurality of default transmit and receive channels.

Abstract: A device having a plug that is configured to mechanically interface with a receptacle external to the device. The plug also has an electrical interface that electrically interfaces with the receptacle even though the external receptacle has a mechanical and electrical interface shaped to interface with an integrated cable that includes an optical communication mechanism for communicating over most of the length of the integrated cable, and even though the device itself has a full electrical communication channel communicatively coupling a data communication endpoint of the device with the electrical interface of the plug.

Abstract: An optical receiver assembly that is configured to avoid the introduction of feedback in an electrical signal converted by the assembly is disclosed. In one embodiment, an optical receiver assembly is disclosed, comprising a capacitor, an optical detector provided with a power supply being mounted on a top electrode of the capacitor, and an amplifier mounted on the reference surface. The assembly further includes an isolator interposed between the reference surface and the capacitor, wherein the isolator includes a bottom layer of dielectric material that is affixed to a portion of the reference surface, and a metallic top plate that is electrically coupled both to a ground of the amplifier and to the capacitor. This configuration bootstraps the amplifier ground to the amplifier input via the photodiode top electrode of the capacitor to cancel out feedback signals present at the amplifier ground.

Abstract: An integrated cable configured to communicate over much of its length using one or more optical fibers includes an electrical connector at least one end. The electrical connector at a first end of the integrated cable and an optoelectronic device coupled to or included in the other end of the integrated cable may utilize a bidirectional status link to transmit status data to each other. If the status data indicates that optical signals transmitted over the optical channels between the two devices are not potentially exposed to view, the two devices may operate above nominal eye safety limits. Otherwise, the two devices may operate at or below nominal eye safety limits. If the second optoelectronic device is not status-link enabled, the first optoelectronic device may operate at or below nominal eye safety limits.

Abstract: A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.

Abstract: An optical receiver assembly that is configured to avoid the introduction of feedback in an electrical signal converted by the assembly is disclosed. In one embodiment, an optical receiver assembly is disclosed, comprising a capacitor, an optical detector provided with a power supply being mounted on a top electrode of the capacitor, and an amplifier mounted on the reference surface. The assembly further includes an isolator interposed between the reference surface and the capacitor, wherein the isolator includes a bottom layer of dielectric material that is affixed to a portion of the reference surface, and a metallic top plate that is electrically coupled both to a ground of the amplifier and to the capacitor. This configuration bootstraps the amplifier ground to the amplifier input via the photodiode top electrode of the capacitor to cancel out feedback signals present at the amplifier ground.

Abstract: A robust and redundant status link is established by a first multi-channel optoelectronic device with a second multi-channel optoelectronic device in a multi-channel communication link. Transmitter bias currents are effectively modulated with a status link modulation signal representative of status data and subsequently modulated with primary data modulation signals. The resulting signals are transformed into optical signals and transmitted over the link as main communication links combined with a status link. At the second device, the optical signals are received and converted to electrical signals. The receipt of the optical signals creates multiple receiver bias currents, which may be monitored to detect the status link modulation signal. The second device may adjust various operating parameters in response to the information conveyed by the status link.

Abstract: An embodiment disclosed herein relates to a communications module. The communications module includes a body composed of a plastic resin and a plurality of conductive traces and contact pads defined on a portion of a surface of the body. The module also includes at least one substantially vertical ridge defined on the body surface, and at least one pocket defined on the body suitable for receiving an electronic component. The communications module may also include a body composed of a plastic resin and conductive features defined on a surface of the body configured to render the communications module operable without implementing a printed circuit board as part of the body. Additional embodiments relate to systems and methods for attaching one or more optical transmit assemblies to the communications module and for electrically connecting conductive traces in a temporary fashion on the surface of the body of the communications module.

Abstract: An optical receiver assembly that is configured to avoid the introduction of feedback in an electrical signal converted by the assembly is disclosed. In one embodiment, an optical receiver assembly is disclosed, comprising a capacitor, an optical detector provided with a power supply being mounted on a top electrode of the capacitor, and an amplifier mounted on the reference surface. The assembly further includes an isolator interposed between the reference surface and the capacitor, wherein the isolator includes a bottom layer of dielectric material that is affixed to a portion of the reference surface, and a metallic top plate that is electrically coupled both to a ground of the amplifier and to the capacitor. This configuration bootstraps the amplifier ground to the amplifier input via the photodiode top electrode of the capacitor to cancel out feedback signals present at the amplifier ground.

Abstract: A robust and redundant status link is established by a first multi-channel optoelectronic device with a second multi-channel optoelectronic device in a multi-channel communication link. Transmitter bias currents are effectively modulated with a status link modulation signal representative of status data and subsequently modulated with primary data modulation signals. The resulting signals are transformed into optical signals and transmitted over the link as main communication links combined with a status link. At the second device, the optical signals are received and converted to electrical signals. The receipt of the optical signals creates multiple receiver bias currents, which may be monitored to detect the status link modulation signal. The second device may adjust various operating parameters in response to the information conveyed by the status link.

Abstract: A device having a plug that is configured to mechanically interface with a receptacle external to the device. The plug also has an electrical interface that electrically interfaces with the receptacle even though the external receptacle has a mechanical and electrical interface shaped to interface with an integrated cable that includes an optical communication mechanism for communicating over most of the length of the integrated cable, and even though the device itself has a full electrical communication channel communicatively coupling a data communication endpoint of the device with the electrical interface of the plug.

Abstract: An edge connector suitable for attachment with a printed circuit board. The edge connector comprises a body composed of a plastic resin, the body defining a first end that is configured to operably attach to a portion of a printed circuit board and a second end configured to operably connect to a slot in a host device and a plurality of conductive traces and contact pads defined on a portion of a surface of the body, the traces being configured to electrically connect with corresponding traces defined on the printed circuit board.

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part, and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract: Integrated optical subassemblies (OSA) such as integrated transmit and receive optical subassemblies that may be implemented with an optical transceiver module that includes a molded body. The integrated OSA includes a mounting surface defined on a vertical portion of the molded body, a wall extending about the mounting surface, at least one optoelectronic device, such as a laser diode or a photodiode mounted on a transimpendence amplifier, positioned on the mounting surface, a plurality of bond pads included on the mounting surface in electrical connection with the at least one optoelectronic device, a plurality of conductive feedthroughs defined through the mounting surface, each feedthrough being in electrical communication with a corresponding one of the bond pads; and an optical fiber port that engages the wall extending about the mounting surface, wherein the optical fiber port is configured for receiving an optical fiber cable.