Abstract: A vertical wafer boat for supporting at least one semiconductor wafer, formed by a process includes forming a plurality of angled support grooves into a plurality of support members with a groove-making machine. Each support member extends along a longitudinal axis and each of the support grooves is spaced apart from one another and extend generally obliquely into the respective support member with respect to the longitudinal axis. The groove-making machine is positioned at a nonperpendicular angle with respect to the longitudinal axis, and thus defines an angled tooth between adjoining support grooves to support at least one wafer, and each support groove includes top and bottom corners inside a base portion that are generally supplementary with respect to each other. Top and bottom portions of the plurality of members are joined to top and bottom end plates that oppose each other respectively, to form the wafer boat.