Patents by Inventor Darin KRAJEWSKI
Darin KRAJEWSKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240294130Abstract: A system and method for sound-activated remote control of vehicle functions for a vehicle having a remote-control system, the remote-control system has a key fob and at least one vehicle control module. A sound sensor module of a stand-alone smart sound sensor detects a sound event, correlates the sound event with a code, and transmits the code to the remote-control system to activate a function on the vehicle that is associated with the code.Type: ApplicationFiled: February 22, 2024Publication date: September 5, 2024Applicant: Harman International Industries, IncorporatedInventors: Yu Du, Mitul Hemendra Jhala, Darin Krajewski
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Patent number: 12078525Abstract: A vibration sensor assembly having a rigid surface and a transducer integrated with the rigid surface. The transducer measures structure-borne sound waves that cause vibration motion of the rigid surface. The rigid surface may be glass, metal or plastic and may be part of an interior part or panel, or an exterior panel, of a vehicle.Type: GrantFiled: March 21, 2022Date of Patent: September 3, 2024Assignee: Harman International Industries, IncorporatedInventors: Yu Du, Darin Krajewski
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Publication number: 20230366727Abstract: In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.Type: ApplicationFiled: July 28, 2023Publication date: November 16, 2023Inventors: Darin KRAJEWSKI, Yu DU, Péter Atilla KARDOS, Flórián CZINEGE
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Publication number: 20230296428Abstract: A vibration sensor assembly having a rigid surface and a transducer integrated with the rigid surface. The transducer measures structure-borne sound waves that cause vibration motion of the rigid surface. The rigid surface may be glass, metal or plastic and may be part of an interior part or panel, or an exterior panel, of a vehicle.Type: ApplicationFiled: March 21, 2022Publication date: September 21, 2023Applicant: Harman International Industries, IncorporatedInventors: Yu Du, Darin Krajewski
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Patent number: 11743656Abstract: In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.Type: GrantFiled: May 27, 2021Date of Patent: August 29, 2023Assignee: Harman International Industries, IncorporatedInventors: Darin Krajewski, Yu Du, Péter Atilla Kardos, Flórián Czinege
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Patent number: 11638077Abstract: A microphone assembly includes a shaft element that is configured to be received in an opening defined by a base substrate layer of a headliner. The shaft element defines an air path. The microphone assembly includes a microphone element mounted on a circuit board within a housing. The microphone element is aligned with the air path such that the air path directs sound from the cabin to the microphone element. A vehicle cabin side of the headliner is covered by an acoustically transparent layer such that the microphone assembly is not visible within the vehicle cabin.Type: GrantFiled: August 3, 2021Date of Patent: April 25, 2023Assignee: Harman Becker Automotive Systems GmbHInventors: Marco Salvatore Riemann, Darin Krajewski, Marian Avram, Viktor Dobos
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Patent number: 11533568Abstract: In at least one embodiment, a sound and vibration sensor is provided. The sound and vibration sensor includes a housing, a piezo-diaphragm, and a flexible support plate. The piezo-diaphragm is positioned in the housing to detect an input signal including audio or vibrations. The flexible support plate receives the piezo-diaphragm to enable the sensor to exhibit a frequency response with a plurality of resonant frequencies in response to detecting the audio or the vibrations on the input signal.Type: GrantFiled: May 27, 2021Date of Patent: December 20, 2022Assignee: Harman International Industries, IncorporatedInventors: Yu Du, Péter Atilla Kardos, Darin Krajewski, Flórián Czinege
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Publication number: 20220386038Abstract: In at least one embodiment, a sound and vibration sensor is provided. The sound and vibration sensor includes a housing, a piezo-diaphragm, and a flexible support plate. The piezo-diaphragm is positioned in the housing to detect an input signal including audio or vibrations. The flexible support plate receives the piezo-diaphragm to enable the sensor to exhibit a frequency response with a plurality of resonant frequencies in response to detecting the audio or the vibrations on the input signal.Type: ApplicationFiled: May 27, 2021Publication date: December 1, 2022Inventors: Yu DU, Péter Atilla KARDOS, Darin KRAJEWSKI, Flórián CZINEGE
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Publication number: 20220386039Abstract: In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.Type: ApplicationFiled: May 27, 2021Publication date: December 1, 2022Inventors: Darin KRAJEWSKI, Yu DU, Péter Atilla KARDOS, Flórián CZINEGE
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Publication number: 20210368252Abstract: A microphone assembly includes a shaft element that is configured to be received in an opening defined by a base substrate layer of a headliner. The shaft element defines an air path. The microphone assembly includes a microphone element mounted on a circuit board within a housing. The microphone element is aligned with the air path such that the air path directs sound from the cabin to the microphone element. A vehicle cabin side of the headliner is covered by an acoustically transparent layer such that the microphone assembly is not visible within the vehicle cabin.Type: ApplicationFiled: August 3, 2021Publication date: November 25, 2021Inventors: Marco Salvatore RIEMANN, Darin KRAJEWSKI, Marian AVRAM, Viktor DOBOS
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Patent number: 11109134Abstract: A microphone assembly includes a shaft element that is configured to be received in an opening defined by a base substrate layer of a headliner. The shaft element defines an air path. The microphone assembly includes a microphone element mounted on a circuit board within a housing. The microphone element is aligned with the air path such that the air path directs sound from the cabin to the microphone element. A vehicle cabin side of the headliner is covered by an acoustically transparent layer such that the microphone assembly is not visible within the vehicle cabin.Type: GrantFiled: May 24, 2019Date of Patent: August 31, 2021Assignee: Harman Becker Automotive Systems GmbHInventors: Marco Salvatore Riemann, Darin Krajewski, Marian Avram, Viktor Dobos
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Patent number: 10945060Abstract: A microphone assembly includes a printed circuit board that defines a tab that is configured to extend into an opening defined by a substrate layer of a headliner. The microphone assembly includes a microphone element mounted on the tab. The microphone assembly includes a sealing element that surrounds the tab and the microphone element and is configured to fill the opening and define an air path from a cabin side of the substrate layer to the printed circuit board or the microphone element.Type: GrantFiled: November 1, 2019Date of Patent: March 9, 2021Assignee: Harman Becker Automotive Systems GmbHInventors: Marco Salvatore Riemann, Darin Krajewski, Viktor Dobos, Zoltan Giang-Son Kleinheincz, Florian Czinege
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Publication number: 20200145743Abstract: A microphone assembly includes a printed circuit board that defines a tab that is configured to extend into an opening defined by a substrate layer of a headliner. The microphone assembly includes a microphone element mounted on the tab. The microphone assembly includes a sealing element that surrounds the tab and the microphone element and is configured to fill the opening and define an air path from a cabin side of the substrate layer to the printed circuit board or the microphone element.Type: ApplicationFiled: November 1, 2019Publication date: May 7, 2020Inventors: Marco Salvatore Riemann, Darin Krajewski, Viktor Dobos, Zollan Giang-Son Kleinheincz, Florian Czinege
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Publication number: 20190364351Abstract: A microphone assembly includes a shaft element that is configured to be received in an opening defined by a base substrate layer of a headliner. The shaft element defines an air path. The microphone assembly includes a microphone element mounted on a circuit board within a housing. The microphone element is aligned with the air path such that the air path directs sound from the cabin to the microphone element. A vehicle cabin side of the headliner is covered by an acoustically transparent layer such that the microphone assembly is not visible within the vehicle cabin.Type: ApplicationFiled: May 24, 2019Publication date: November 28, 2019Inventors: Marco Salvatore RIEMANN, Darin KRAJEWSKI, Marian AVRAM, Viktor DOBOS