Patents by Inventor Darin KRAJEWSKI

Darin KRAJEWSKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230366727
    Abstract: In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 16, 2023
    Inventors: Darin KRAJEWSKI, Yu DU, Péter Atilla KARDOS, Flórián CZINEGE
  • Publication number: 20230296428
    Abstract: A vibration sensor assembly having a rigid surface and a transducer integrated with the rigid surface. The transducer measures structure-borne sound waves that cause vibration motion of the rigid surface. The rigid surface may be glass, metal or plastic and may be part of an interior part or panel, or an exterior panel, of a vehicle.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 21, 2023
    Applicant: Harman International Industries, Incorporated
    Inventors: Yu Du, Darin Krajewski
  • Patent number: 11743656
    Abstract: In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: August 29, 2023
    Assignee: Harman International Industries, Incorporated
    Inventors: Darin Krajewski, Yu Du, Péter Atilla Kardos, Flórián Czinege
  • Patent number: 11638077
    Abstract: A microphone assembly includes a shaft element that is configured to be received in an opening defined by a base substrate layer of a headliner. The shaft element defines an air path. The microphone assembly includes a microphone element mounted on a circuit board within a housing. The microphone element is aligned with the air path such that the air path directs sound from the cabin to the microphone element. A vehicle cabin side of the headliner is covered by an acoustically transparent layer such that the microphone assembly is not visible within the vehicle cabin.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: April 25, 2023
    Assignee: Harman Becker Automotive Systems GmbH
    Inventors: Marco Salvatore Riemann, Darin Krajewski, Marian Avram, Viktor Dobos
  • Patent number: 11533568
    Abstract: In at least one embodiment, a sound and vibration sensor is provided. The sound and vibration sensor includes a housing, a piezo-diaphragm, and a flexible support plate. The piezo-diaphragm is positioned in the housing to detect an input signal including audio or vibrations. The flexible support plate receives the piezo-diaphragm to enable the sensor to exhibit a frequency response with a plurality of resonant frequencies in response to detecting the audio or the vibrations on the input signal.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: December 20, 2022
    Assignee: Harman International Industries, Incorporated
    Inventors: Yu Du, Péter Atilla Kardos, Darin Krajewski, Flórián Czinege
  • Publication number: 20220386038
    Abstract: In at least one embodiment, a sound and vibration sensor is provided. The sound and vibration sensor includes a housing, a piezo-diaphragm, and a flexible support plate. The piezo-diaphragm is positioned in the housing to detect an input signal including audio or vibrations. The flexible support plate receives the piezo-diaphragm to enable the sensor to exhibit a frequency response with a plurality of resonant frequencies in response to detecting the audio or the vibrations on the input signal.
    Type: Application
    Filed: May 27, 2021
    Publication date: December 1, 2022
    Inventors: Yu DU, Péter Atilla KARDOS, Darin KRAJEWSKI, Flórián CZINEGE
  • Publication number: 20220386039
    Abstract: In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.
    Type: Application
    Filed: May 27, 2021
    Publication date: December 1, 2022
    Inventors: Darin KRAJEWSKI, Yu DU, Péter Atilla KARDOS, Flórián CZINEGE
  • Publication number: 20210368252
    Abstract: A microphone assembly includes a shaft element that is configured to be received in an opening defined by a base substrate layer of a headliner. The shaft element defines an air path. The microphone assembly includes a microphone element mounted on a circuit board within a housing. The microphone element is aligned with the air path such that the air path directs sound from the cabin to the microphone element. A vehicle cabin side of the headliner is covered by an acoustically transparent layer such that the microphone assembly is not visible within the vehicle cabin.
    Type: Application
    Filed: August 3, 2021
    Publication date: November 25, 2021
    Inventors: Marco Salvatore RIEMANN, Darin KRAJEWSKI, Marian AVRAM, Viktor DOBOS
  • Patent number: 11109134
    Abstract: A microphone assembly includes a shaft element that is configured to be received in an opening defined by a base substrate layer of a headliner. The shaft element defines an air path. The microphone assembly includes a microphone element mounted on a circuit board within a housing. The microphone element is aligned with the air path such that the air path directs sound from the cabin to the microphone element. A vehicle cabin side of the headliner is covered by an acoustically transparent layer such that the microphone assembly is not visible within the vehicle cabin.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: August 31, 2021
    Assignee: Harman Becker Automotive Systems GmbH
    Inventors: Marco Salvatore Riemann, Darin Krajewski, Marian Avram, Viktor Dobos
  • Patent number: 10945060
    Abstract: A microphone assembly includes a printed circuit board that defines a tab that is configured to extend into an opening defined by a substrate layer of a headliner. The microphone assembly includes a microphone element mounted on the tab. The microphone assembly includes a sealing element that surrounds the tab and the microphone element and is configured to fill the opening and define an air path from a cabin side of the substrate layer to the printed circuit board or the microphone element.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: March 9, 2021
    Assignee: Harman Becker Automotive Systems GmbH
    Inventors: Marco Salvatore Riemann, Darin Krajewski, Viktor Dobos, Zoltan Giang-Son Kleinheincz, Florian Czinege
  • Publication number: 20200145743
    Abstract: A microphone assembly includes a printed circuit board that defines a tab that is configured to extend into an opening defined by a substrate layer of a headliner. The microphone assembly includes a microphone element mounted on the tab. The microphone assembly includes a sealing element that surrounds the tab and the microphone element and is configured to fill the opening and define an air path from a cabin side of the substrate layer to the printed circuit board or the microphone element.
    Type: Application
    Filed: November 1, 2019
    Publication date: May 7, 2020
    Inventors: Marco Salvatore Riemann, Darin Krajewski, Viktor Dobos, Zollan Giang-Son Kleinheincz, Florian Czinege
  • Publication number: 20190364351
    Abstract: A microphone assembly includes a shaft element that is configured to be received in an opening defined by a base substrate layer of a headliner. The shaft element defines an air path. The microphone assembly includes a microphone element mounted on a circuit board within a housing. The microphone element is aligned with the air path such that the air path directs sound from the cabin to the microphone element. A vehicle cabin side of the headliner is covered by an acoustically transparent layer such that the microphone assembly is not visible within the vehicle cabin.
    Type: Application
    Filed: May 24, 2019
    Publication date: November 28, 2019
    Inventors: Marco Salvatore RIEMANN, Darin KRAJEWSKI, Marian AVRAM, Viktor DOBOS