Patents by Inventor Darin Lee

Darin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11910566
    Abstract: A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: February 20, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Luke Thomas Gregory, Darin Lee Frink, Rick Chun Kit Cheung, Nafea Bshara, Kenny Kiet Huynh, Noah Kelly, Priti Choudhary, Ali Elashri
  • Patent number: 11868191
    Abstract: Methods for providing power to electronic components (e.g., servers in a datacenter, or other devices) can include providing AC power received from an external source to the devices. During periods of high demand, when costs of external AC power exceed a threshold, or when availability of external AC power is decreased, distributed backup power supply systems can be utilized to temporarily offset or to reverse consumption of external AC power. Such distributed backup power systems can be periodically recharged during periods of low power demand, and thus consistently retain adequate charge for backup use in the event of power loss.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: January 9, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Ligong Wang, Darin Lee Frink
  • Patent number: 11868301
    Abstract: A computer system includes symmetrical sets of motherboard serial channels which couple processor devices on a motherboard with a common serial link interface. The common serial link interface can be coupled with an endpoint device to establish symmetrical serial links between the endpoint device and the processor devices. The computer system can include a riser card which can be coupled with the serial link interface. The riser card can include an endpoint device interface and serial channels which can couple the processor devices with the endpoint device via symmetrical limited selections of the motherboard serial channels. The riser can include additional interfaces which can couple the processor devices with additional expansion devices.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: January 9, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Darin Lee Frink, Michael Jon Moen, Christopher Nathan Watson
  • Patent number: 11853771
    Abstract: A branded fleet server system includes a pre-assembled third-party computer system integrated into a chassis of the branded fleet server system. The pre-assembled third-party computer system is configured to execute proprietary software that is only licensed for use on branded hardware. A virtualization offloading component is included in the server chassis of the branded fleet server along with the pre-assembled third-party computer system. The virtualization offloading component acts as a bridge between the pre-assembled third-party computer system and a virtualized computing service. As such, the virtualization offloading component manages communications, security, metadata, etc. to allow the pre-assembled computer system to function as one of a fleet of virtualization hosts of the virtualized computing service.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: December 26, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Peter Zachary Bowen, Darin Lee Frink, Eric Robert Northup, David A Skirmont, Manish Singh Rathaur
  • Patent number: 11842049
    Abstract: Technologies are provided for dynamically changing a size of a cache region of a storage device. A storage device controller writes data to the cache region of the storage device using a particular storage format. The storage device controller then migrates the cached data to a storage region of the device, where the data is written using a different storage format. A dynamic cache manager monitors input and output activity for the storage device and dynamically adjusts a size of the cache region to adapt to changes in the input and/or output activity. The dynamic cache manager can also adjust a size of the storage region. The storage device controller can automatically detect that the storage device has dynamic cache support and configure the storage device by creating the cache region and the storage region on the device.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: December 12, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Munif M. Farhan, Phyllis Ng, Darin Lee Frink, Nafea Bshara
  • Patent number: 11800693
    Abstract: A rack-mountable server system includes air moving systems, such as fans, to induce airflow inside a server chassis to remove heat generated by components of the server system. The air moving systems are configured to direct air from a cold aisle, through the chassis of the server system, and out to a hot aisle as exhausted air. The server system is configured to be mounted in racks that provide cooling air on either a front or rear side of the rack. Thus, the server system is able to be mounted in a rack in a reversible Input/Output (IO) orientation and can accommodate multiple airflow directions through the server chassis to conform to a hot aisle and cold aisle configuration used for a given rack at a given facility at which the server system is mounted.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: October 24, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Shreyas Sampath, Darin Lee Frink, Bianca Nagy
  • Publication number: 20230255002
    Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 10, 2023
    Applicant: Amazon Technologies, Inc.
    Inventors: David Edward Bryan, Christopher Strickland Beall, Darin Lee Frink
  • Patent number: 11659694
    Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: May 23, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: David Edward Bryan, Christopher Strickland Beall, Darin Lee Frink
  • Patent number: 11628572
    Abstract: A robotic pack station is disclosed. The robotic pack station automates the transfer of items from a tote or bin to a shipping container such as a box in a warehouse, storage or sales facility. The robotic pack station includes system and method components, and includes a work cell with a robotic arm, machine vision or sensing system, a conveyor and pack platform. Imaging of the contents of the tote with a scan tunnel and connectivity with a sorter device allows for the operation of multiple robotic pack stations, each with a specialized function such as a small box line, a medium box line, and the like.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: April 18, 2023
    Assignee: MSC Services Corp.
    Inventor: Darin Lee Russell
  • Patent number: 11604495
    Abstract: A rack-mountable computer system directs separate portions of a cooling airflow from an inlet air plenum in the computer system interior through separate air passages to remove heat from separate portions of a set of heat-producing components. The air passages can preclude a portion of cooling airflow removing heat from a component from being preheated by another component. Plenums and air passages can be established through the arrangement of components in the interior. Components can be arranged in progressive offsets throughout the depth of the interior to vary plenum flow area throughout the depth, which can progressively impede and redirect airflow through the inlet plenum into the air passages. Arrangements can include an angled row, a staggered configuration, etc. The computer system can include a chassis which can translate, while maintaining operation of hot-pluggable electronic components coupled throughout the depth, to enable swapping of hot-pluggable electronic components throughout the interior.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: March 14, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Christopher Strickland Beall, David Edward Bryan, Darin Lee Frink
  • Patent number: 11553626
    Abstract: A system for storing data includes a discrete cooling module that can enable discrete cooling of mass storage devices installed in the chassis interior of a data storage module coupled to a rack. The discrete cooling module includes an air moving device and an air cover. The air moving device can induce and airflow through the chassis interior of the data storage module to remove heat from heat producing components of mass storage devices installed in the chassis interior. The air cover directs the airflow through the chassis interior. The discrete cooling module can isolate rotational vibrations generated by the air moving device from the mass storage devices installed in the chassis. Partial isolation can include indirectly coupling the discrete cooling module to the chassis via directly coupling with the rack.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: January 10, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Christopher Strickland Beall, David Edward Bryan, Darin Lee Frink, Jason Alexander Harland
  • Patent number: 11509711
    Abstract: A computing system providing virtual computing services may maintain a fleet of servers that host virtual machine instances having a wide variety of types and configurations. A service provider may rent processor and memory capacity by defining and offering various virtual machine instances to clients. Each virtual machine instance may include one or more virtual CPUs and a fixed amount of virtualized memory allocated to each virtual CPU, dependent on a predefined ratio between virtual CPU capacity and virtualized memory capacity for the instance type. Each server may include a custom, non-standard sized physical memory module containing memory devices of multiple technologies, types, or sizes on the same printed circuit board. By including custom memory modules, rather than relying only on standard memory modules, the service provider system may implement virtual machines having finer grained options for processor and memory capacity combinations, and may avoid stranding rentable resources.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: November 22, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Darin Lee Frink, Brent Kenneth Clore
  • Publication number: 20220292044
    Abstract: A system for storing data includes a rack, one or more data storage modules coupled to the rack, and one or more data control modules coupled to the rack. The data storage modules may include a chassis, two or more backplanes coupled to the chassis, and one or more mass storage devices (for example, hard disk drives) coupled to the backplanes. The data control modules may access the mass storage devices in the data storage modules.
    Type: Application
    Filed: May 27, 2022
    Publication date: September 15, 2022
    Applicant: Amazon Technologies, Inc.
    Inventors: Darin Lee Frink, Peter George Ross
  • Publication number: 20220264770
    Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.
    Type: Application
    Filed: May 6, 2022
    Publication date: August 18, 2022
    Applicant: Amazon Technologies, Inc.
    Inventors: David Edward Bryan, Christopher Strickland Beall, Darin Lee Frink
  • Patent number: 11395433
    Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes a chassis with one or more arrays of devices in the chassis. Each array includes mass storage devices and a server device mounted in the array within the chassis of the server system. The server device occupies no more than an equivalent volume of space in the chassis as one of the mass storage devices. A set of mass storage devices of an array and the server device of the array form a logical node, and a server system may include multiple logical nodes in the same chassis. Each array of devices may be located in a sled that can move into and out of the chassis of the server system.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: July 19, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Darin Lee Frink, Roey Rivnay, Christopher Strickland Beall, Felipe Enrique Ortega Gutierrez
  • Patent number: 11347674
    Abstract: A system for storing data includes a rack, one or more data storage modules coupled to the rack, and one or more data control modules coupled to the rack. The data storage modules may include a chassis, two or more backplanes coupled to the chassis, and one or more mass storage devices (for example, hard disk drives) coupled to the backplanes. The data control modules may access the mass storage devices in the data storage modules.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: May 31, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Darin Lee Frink, Peter George Ross
  • Patent number: 11330740
    Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 10, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: David Edward Bryan, Christopher Strickland Beall, Darin Lee Frink
  • Patent number: 11314437
    Abstract: Technologies are provided for storing data by alternating the performance of data write operations using multiple clusters of storage devices. Data is written to internal buffers of storage devices in one cluster while data stored in buffers of storage devices in another cluster is transferred to the storage devices' permanent storages. When available buffer capacity in a cluster falls below a specified threshold, data write commands are no longer sent the cluster and the storage devices in the cluster transfer data stored in their buffers to their permanent storages. While the data is being transferred, data write commands are transmitted to other clusters. When the data transfer is complete, the storage devices in the cluster can be scheduled to receive data write commands again. A cluster can be selected for performing a given data write request by matching the attributes of the cluster to parameters of the data write request.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: April 26, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Munif M. Farhan, Darin Lee Frink, Douglas Stewart Laurence
  • Publication number: 20220098568
    Abstract: The present invention provides histidyl-tRNA synthetase and Fc region conjugate polypeptides (HRS-Fc conjugates), such as HRS-Fc fusion polypeptides, compositions comprising the same, and methods of using such conjugates and compositions for treating or diagnosing a variety of conditions. The HRS-Fc conjugates of the invention have improved controlled release properties, stability, half-life, and other pharmacokinetic and biological properties relative to corresponding, unmodified HRS polypeptides.
    Type: Application
    Filed: June 10, 2021
    Publication date: March 31, 2022
    Inventors: Chi-Fang WU, Darin LEE, Jeffry D. WATKINS, Kristi PIEHL, Kyle CHIANG, Marc THOMAS, Minh-Ha DO, Ying BUECHLER, John D. MENDLEIN
  • Patent number: D944386
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: February 22, 2022
    Inventor: Darin Lee Mays