Patents by Inventor Darin Olson

Darin Olson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit micro-cooler having multi-layers of tubes of a CNT array
    Patent number: 7538422
    Abstract: Heat sink structures employing multi-layers of carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In one embodiment, the nanotubes are cut to essentially the same length over the surface of the structure. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
    Type: Grant
    Filed: September 18, 2006
    Date of Patent: May 26, 2009
    Assignee: Nanoconduction Inc.
    Inventors: Carlos Dangelo, Darin Olson
  • Integrated Circuit Micro-Cooler Having Tubes of a CNT Array in Essentially the Same Height over a Surface
    Publication number: 20070126116
    Abstract: Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink, where the nanotubes are cut to essentially the same length over the surface of the structure, are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface having high axial and lateral thermal conductivities.
    Type: Application
    Filed: September 18, 2006
    Publication date: June 7, 2007
    Inventors: Carlos Dangelo, Darin Olson
  • INTEGRATED CIRCUIT MICRO-COOLER HAVING MULTI-LAYERS OF TUBES OF A CNT ARRAY
    Publication number: 20070114657
    Abstract: Heat sink structures employing mutli-layers of carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In one embodiment, the nanotubes are cut to essentially the same length over the surface of the structure. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
    Type: Application
    Filed: September 18, 2006
    Publication date: May 24, 2007
    Inventors: Carlos Dangelo, Darin Olson
  • Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array
    Publication number: 20070114658
    Abstract: Heat sink structures employing carbon nanotube or nanowire arrays exposed from both opposite surfaces of the structure to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In one embodiment, the nanotubes are cut to essentially the same length over the surface of the structure. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
    Type: Application
    Filed: September 18, 2006
    Publication date: May 24, 2007
    Inventors: Carlos Dangelo, Darin Olson
  • Nanoelectronic sensor system and hydrogen-sensitive functionalization
    Publication number: 20060263255
    Abstract: A new sensing technology for chemical/biomolecular sensors is provided. One such sensor detects molecular hydrogen (H2) using nanoelectronic components. A tiny, low-cost nanosensor chip can offer: (i) performance that matches or exceeds that of existing technology, (ii) plug-and-play simplicity with both digital and analog control systems, and (ii) the small size and low power consumption needed for wireless integration.
    Type: Application
    Filed: February 14, 2006
    Publication date: November 23, 2006
    Inventors: Tzong-Ru Han, Alexander Star, Jean-Christophe Gabriel, Sergei Skarupo, John Passmore, Philip Collins, Keith Bradley, Darin Olson