Patents by Inventor Darin S. Hunzeker

Darin S. Hunzeker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5432457
    Abstract: A probe for measurement of an electrically conductive surface covered by an insulating cover layer has a pair of electrically conductive pads for capacitive coupling to the conductive surface. The pads may be formed by photolithography as part of a disk of a metallic layer disposed on a substrate of low dielectric material such as fibrous glass in an epoxy binder, the pads being separated by a relatively narrow gap. Included within the probe is an electrically insulating holder for supporting the substrate and the pads, the holder being configured to facilitate manual manipulation of the probe. The probe connects with a signal analyzer which provides a test signal coupled to the pads via a coaxial transmission line. During a sliding of the pads along the cover layer, electrical characteristics of a signal coupled capacitively via the pads to the conductive surface are analyzed by the analyzer to provide information on electrical continuity and resistivity of the surface.
    Type: Grant
    Filed: January 28, 1994
    Date of Patent: July 11, 1995
    Assignee: Northrop Grumman Corporation
    Inventors: Kenneth M. Mitzner, Darin S. Hunzeker, William Hant, Silvan S. Locus, John C. Bryant