Patents by Inventor Dario Paci
Dario Paci has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240061236Abstract: A MEMS optical device including: a semiconductor body; a main cavity, which extends within the semiconductor body; a membrane suspended over the main cavity; a piezoelectric actuator, which is mechanically coupled to the membrane and can be electronically controlled so as to deform the membrane; a micro-lens, mechanically coupled to the membrane so as to undergo deformation following the deformation of the membrane; and a rigid optical element, which contacts the micro-lens and is arranged so that the micro-lens is interposed between the rigid optical element and the membrane. The micro-lens and the main cavity are arranged on opposite sides of the membrane.Type: ApplicationFiled: July 25, 2023Publication date: February 22, 2024Applicant: poLight ASAInventors: Enri DUQI, Dario PACI, Lorenzo BALDO, Domenico GIUSTI
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Patent number: 11807517Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.Type: GrantFiled: March 22, 2021Date of Patent: November 7, 2023Assignee: STMICROELECTRONICS S.r.l.Inventors: Dario Paci, Domenico Giusti, Irene Martini
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Patent number: 11747608Abstract: A MEMS optical device including: a semiconductor body; a main cavity, which extends within the semiconductor body; a membrane suspended over the main cavity; a piezoelectric actuator, which is mechanically coupled to the membrane and can be electronically controlled so as to deform the membrane; a micro-lens, mechanically coupled to the membrane so as to undergo deformation following the deformation of the membrane; and a rigid optical element, which contacts the micro-lens and is arranged so that the micro-lens is interposed between the rigid optical element and the membrane. The micro-lens and the main cavity are arranged on opposite sides of the membrane.Type: GrantFiled: April 13, 2020Date of Patent: September 5, 2023Inventors: Enri Duqi, Dario Paci, Lorenzo Baldo, Domenico Giusti
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Patent number: 11737369Abstract: An integrated magnetoresistive device includes a substrate of semiconductor material that is covered, on a first surface, by an insulating layer. A magnetoresistor of ferromagnetic material extends within the insulating layer and defines a sensitivity plane of the sensor. A concentrator of ferromagnetic material includes at least one arm that extends in a transversal direction to the sensitivity plane and is vertically offset from the magnetoresistor. The concentrator concentrates deflects magnetic flux lines perpendicular to the sensitivity plane so as to generate magnetic-field components directed in a parallel direction to the sensitivity plane.Type: GrantFiled: June 9, 2021Date of Patent: August 22, 2023Assignee: STMicroelectronics S.r.l.Inventors: Dario Paci, Marco Morelli, Caterina Riva
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Publication number: 20230204974Abstract: A method of making a MEMS actuator with a monolithic body of semiconductor material includes forming a supporting portion of semiconductor material, orientable with respect to first and second rotation axes, the first rotation axis being transverse with respect to the second rotation axis, and forming a first frame of semiconductor material. The method further includes forming first deformable elements, of semiconductor material, coupled to the first frame, and configured to control a rotation of the supporting portion about the first rotation axis. The method also includes forming a second frame of semiconductor material, and forming second deformable elements, of semiconductor material, coupled to the first frame and to the second frame, and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements are formed to carry respective first and second piezoelectric actuation elements.Type: ApplicationFiled: February 17, 2023Publication date: June 29, 2023Applicant: STMicroelectronics S.r.l.Inventors: Domenico GIUSTI, Dario PACI
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Patent number: 11614634Abstract: A MEMS actuator includes a monolithic body of semiconductor material, with a supporting portion of semiconductor material, orientable with respect to a first and second rotation axes, transverse to each other. A first frame of semiconductor material is coupled to the supporting portion through first deformable elements configured to control a rotation of the supporting portion about the first rotation axis. A second frame of semiconductor material is coupled to the first frame by second deformable elements, which are coupled between the first and the second frames and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements carry respective piezoelectric actuation elements.Type: GrantFiled: May 21, 2020Date of Patent: March 28, 2023Assignee: STMicroelectronics S.r.l.Inventors: Domenico Giusti, Dario Paci
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Publication number: 20230005755Abstract: A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.Type: ApplicationFiled: September 12, 2022Publication date: January 5, 2023Applicants: STMicroelectronics S.r.l., STMicroelectronics (MALTA) LtdInventors: Roseanne DUCA, Dario PACI, Pierpaolo RECANATINI
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Patent number: 11443958Abstract: A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.Type: GrantFiled: December 1, 2020Date of Patent: September 13, 2022Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) LtdInventors: Roseanne Duca, Dario Paci, Pierpaolo Recanatini
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Patent number: 11427463Abstract: A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.Type: GrantFiled: October 19, 2018Date of Patent: August 30, 2022Assignee: STMicroelectronics S.r.l.Inventors: Dario Paci, Marco Ferrera, Andrea Picco
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Publication number: 20220238485Abstract: A packaged electronic system having a support formed by an insulating organic substrate housing a buried conductive region that is floating. A first die is fixed to the support and carries, on a first main surface, a first die contact region capacitively coupled to a first portion of the buried conductive region. A second die is fixed to the support and carries, on a first main surface, a second die contact region capacitively coupled to a second portion of the buried conductive region. A packaging mass encloses the first die, the second die, the first die contact region, the second die contact region, and, at least partially, the support.Type: ApplicationFiled: January 20, 2022Publication date: July 28, 2022Applicant: STMICROELECTRONICS S.r.l.Inventors: Dario PACI, Silvia ADORNO, Marco DEL SARTO, Fabrizio CERINI, Alex GRITTI
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Publication number: 20220123105Abstract: An electrode structure includes a pad of conductive material, and a conductive strip having a first end physically and electrically coupled to the pad. The pad includes an annular element internally defining a through opening. The first end of the conductive strip is physically and electrically coupled to the annular element by a transition region so that, when the conductive strip undergoes expansion by the thermal effect, a stress spreads from the conductive strip to the annular element by the transition region.Type: ApplicationFiled: October 5, 2021Publication date: April 21, 2022Applicant: STMicroelectronics S.r.l.Inventors: Fabrizio CERINI, Silvia ADORNO, Dario PACI, Marco SALINA
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Publication number: 20210296578Abstract: An integrated magnetoresistive device includes a substrate of semiconductor material that is covered, on a first surface, by an insulating layer. A magnetoresistor of ferromagnetic material extends within the insulating layer and defines a sensitivity plane of the sensor. A concentrator of ferromagnetic material includes at least one arm that extends in a transversal direction to the sensitivity plane and is vertically offset from the magnetoresistor. The concentrator concentrates deflects magnetic flux lines perpendicular to the sensitivity plane so as to generate magnetic-field components directed in a parallel direction to the sensitivity plane.Type: ApplicationFiled: June 9, 2021Publication date: September 23, 2021Applicant: STMicroelectronics S.r.l.Inventors: Dario PACI, Marco MORELLI, Caterina RIVA
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Patent number: 11125835Abstract: An AMR-type integrated magnetoresistive sensor sensitive to perpendicular magnetic fields is formed on a body of semiconductor material covered by an insulating region. The insulating region houses a set/reset coil and a magnetoresistor arranged on the set/reset coil. The magnetoresistor is formed by a magnetoresistive strip of an elongated shape parallel to the preferential magnetization direction. A concentrator of ferromagnetic material is arranged on top of the insulating region as the last element of the sensor and is formed by a plurality of distinct ferromagnetic regions aligned parallel to the preferential magnetization direction.Type: GrantFiled: March 27, 2019Date of Patent: September 21, 2021Assignee: STMICROELECTRONICS S.R.L.Inventor: Dario Paci
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Patent number: 11063211Abstract: An integrated magnetoresistive device includes a substrate of semiconductor material that is covered, on a first surface, by an insulating layer. A magnetoresistor of ferromagnetic material extends within the insulating layer and defines a sensitivity plane of the sensor. A concentrator of ferromagnetic material includes at least one arm that extends in a transversal direction to the sensitivity plane and is vertically offset from the magnetoresistor. The concentrator concentrates deflects magnetic flux lines perpendicular to the sensitivity plane so as to generate magnetic-field components directed in a parallel direction to the sensitivity plane.Type: GrantFiled: November 27, 2018Date of Patent: July 13, 2021Assignee: STMicroelectronics S.r.l.Inventors: Dario Paci, Marco Morelli, Caterina Riva
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Publication number: 20210206625Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.Type: ApplicationFiled: March 22, 2021Publication date: July 8, 2021Applicant: STMICROELECTRONICS S.r.l.Inventors: Dario PACI, Domenico GIUSTI, Irene MARTINI
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Publication number: 20210166949Abstract: A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.Type: ApplicationFiled: December 1, 2020Publication date: June 3, 2021Applicants: STMicroelectronics S.r.l., STMicroelectronics (Malta) LtdInventors: Roseanne DUCA, Dario PACI, Pierpaolo RECANATINI
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Patent number: 10981778Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.Type: GrantFiled: January 24, 2020Date of Patent: April 20, 2021Assignee: STMICROELECTRONICS S.r.l.Inventors: Dario Paci, Domenico Giusti, Irene Martini
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Publication number: 20200371376Abstract: A MEMS actuator includes a monolithic body of semiconductor material, with a supporting portion of semiconductor material, orientable with respect to a first and second rotation axes, transverse to each other. A first frame of semiconductor material is coupled to the supporting portion through first deformable elements configured to control a rotation of the supporting portion about the first rotation axis. A second frame of semiconductor material is coupled to the first frame by second deformable elements, which are coupled between the first and the second frames and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements carry respective piezoelectric actuation elements.Type: ApplicationFiled: May 21, 2020Publication date: November 26, 2020Applicant: STMicroelectronics S.r.l.Inventors: Domenico GIUSTI, Dario PACI
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Publication number: 20200326530Abstract: A MEMS optical device including: a semiconductor body; a main cavity, which extends within the semiconductor body; a membrane suspended over the main cavity; a piezoelectric actuator, which is mechanically coupled to the membrane and can be electronically controlled so as to deform the membrane; a micro-lens, mechanically coupled to the membrane so as to undergo deformation following the deformation of the membrane; and a rigid optical element, which contacts the micro-lens and is arranged so that the micro-lens is interposed between the rigid optical element and the membrane. The micro-lens and the main cavity are arranged on opposite sides of the membrane.Type: ApplicationFiled: April 13, 2020Publication date: October 15, 2020Inventors: Enri DUQI, Dario PACI, Lorenzo BALDO, Domenico GIUSTI
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Patent number: 10794738Abstract: An integrated sensor device including a first die, housing a sensor element to detect a quantity external to the sensor device and transduce the external quantity into an electrical sensing signal; a second die mechanically coupled to the first die so that the first and second dies are stacked on one another along one and the same axis; and at least one heater of a resistive type integrated in the first die and/or in the second die, having a first conduction terminal and a second conduction terminal configured to couple respective first and second conduction terminals of a signal generator for causing an electric current to flow, in use, between the first and second conduction terminals of the heater and generate heat by the Joule effect. It is possible to carry out calibration in temperature of the sensor element.Type: GrantFiled: July 30, 2018Date of Patent: October 6, 2020Assignee: STMicroelectronics S.r.l.Inventors: Dario Paci, Francesco Procopio, Carlo Valzasina, Paolo Angelini, Francesco Diazzi, Roberto Pio Baorda, Danilo Karim Kaddouri