Patents by Inventor Darius Tanksalvala

Darius Tanksalvala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for cooling an electronic component
    Patent number: 7551440
    Abstract: A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat exchanger is configured to provide a working fluid to the at least one heat conducting element to facilitate dissipation of heat from the respective electronic component. The heat exchanger has a form factor dimensioned and configured for mounting in a preconfigured hardware unit slot of a computer chassis.
    Type: Grant
    Filed: January 24, 2007
    Date of Patent: June 23, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christian Belady, Darius Tanksalvala, Gary Gostin
  • System and method for cooling an electronic component
    Publication number: 20080174962
    Abstract: A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat exchanger is configured to provide a working fluid to the at least one heat conducting element to facilitate dissipation of heat from the respective electronic component. The heat exchanger has a form factor dimensioned and configured for mounting in a preconfigured hardware unit slot of a computer chassis.
    Type: Application
    Filed: January 24, 2007
    Publication date: July 24, 2008
    Inventors: Christian Belady, Darius Tanksalvala, Gary Gostin