Abstract: Various additional and alternative aspects are described herein. In some aspects, the present disclosure provides a method of testing a system-on-chip (SoC). The method includes generating data for a plurality of audio channels. The data comprises first data corresponding to a first audio channel and second data corresponding to a second audio channel. The method further includes outputting the first audio channel over a first output port of the SoC for output by a speaker. The method further includes outputting the second audio channel over a second output port. The method further includes looping back the second audio channel from the second output port to a first input port of the SoC as third data. The method further includes comparing the third data to the second data. The method further includes determining if the SoC is operating correctly based on the comparison of the third data to the second data.

Abstract: Various embodiments of methods and systems for just-in-time learning-based predictive thermal management (“JLPTM”) techniques implemented in a portable computing device (“PCD”) are disclosed. Embodiments of JLPTM systems and methods recognize that multiple thermal aggressors affect temperature readings of individual temperature sensors and that thermal events measured by those sensors may be predicted based on historical thermal behavior of the PCD. By monitoring various factors that contribute to thermal energy generation and/or dissipation in the PCD, JLPTM systems and methods may predict thermal events from historical thermal behavior data, identify optimum performance level settings combinations that will reduce thermal energy generation, and set a time in the future to apply an optimum performance level settings combination just-in-time to prevent the thermal event from occurring.

Abstract: Various embodiments of methods and systems for multi-correlative learning thermal management (“MLTM”) techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, thermal energy levels measured by individual temperature sensors in the PCD may be attributable to a plurality of processing components, i.e. thermal aggressors. Generally, as more power is consumed by the thermal aggressors, the resulting generation of thermal energy may cause the temperature thresholds associated with temperature sensors located around the chip to be exceeded, thereby necessitating that the performance of the PCD be sacrificed in an effort to reduce thermal energy generation.