Patents by Inventor Darlene Philip

Darlene Philip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070111145
    Abstract: Thermally developable materials that comprise a support have a conductive backside layer that has increased conductive efficiency. Conductivity is provided by non-acicular metal antimonate particles that are present in an amount greater than 55 and up to 85 dry weight % at a coverage of from about 0.06 to about 0.5 g/m2, and the ratio of total binder polymers in the backside conductive layer to the non-acicular metal antimonate particles is less than 0.75:1 (dry weights). The level of conductive particles is reduced from previous uses without an unacceptable loss in conductivity. In addition, the dry thickness of the conductive layer is considerably reduced.
    Type: Application
    Filed: December 20, 2006
    Publication date: May 17, 2007
    Inventors: Thomas Ludemann, Gary LaBelle, Roland Koestner, John Hefley, Aparna Bhave, Thomas Geisler, Darlene Philip
  • Publication number: 20060210931
    Abstract: Thermally developable materials including photothermographic and thermographic materials having an outermost backside layer that includes amorphous silica particles having a narrow particle size distribution. The narrower particle size distribution provides reduced haze and increased surface roughness that reduces blocking and machine feeding at comparable weight percent. The materials can also include conductive layers underneath the outermost backside layer.
    Type: Application
    Filed: March 17, 2005
    Publication date: September 21, 2006
    Inventors: Darlene Philip, Thomas Ludemann, Roland Koestner, Gary LaBelle
  • Publication number: 20060194158
    Abstract: The use of metal antimonates at high metal antimonate to binder ratios in buried backside conductive layers of thermographic and photothermographic materials allows the use of thin backside overcoat layers. The combination provides antistatic constructions having excellent antistatic properties that show less change in resistivity with changes in humidity. The thin backside overcoat layer serves to protect the buried antistatic layer.
    Type: Application
    Filed: May 9, 2006
    Publication date: August 31, 2006
    Inventors: Thomas Ludemann, Gary LaBelle, Darlene Philip, Roland Koestner, Aparna Bhave
  • Publication number: 20060177781
    Abstract: Buried backside conductive layers with increased conductive efficiency can be provided for thermally developable materials using a specific organic solvent mixture to coat a protective overcoat directly disposed over the conductive layer. This organic solvent mixture comprises an alcohol in which one or more film-forming polymers used in the formulation are soluble at room temperature. The alcohol is used in an amount of more than 10 and up to 90 weight % of the organic solvent mixture.
    Type: Application
    Filed: February 8, 2005
    Publication date: August 10, 2006
    Inventors: Thomas Ludemann, Aparna Bhave, Gary LaBelle, Darlene Philip, Samuel Chen
  • Publication number: 20060046932
    Abstract: Thermally developable materials that comprise a support have a conductive backside layer that has increased conductive efficiency. Conductivity is provided by non-acicular metal antimonate particles that are present in an amount greater than 55 and up to 85 dry weight % at a coverage of from about 0.06 to about 0.5 g/m2, and the ratio of total binder polymers in the backside conductive layer to the non-acicular metal antimonate particles is less than 0.75:1 (dry weights). The level of conductive particles is reduced from previous uses without an unacceptable loss in conductivity. In addition, the dry thickness of the conductive layer is considerably reduced.
    Type: Application
    Filed: August 31, 2004
    Publication date: March 2, 2006
    Inventors: Thomas Ludemann, Gary LaBelle, Roland Koestner, John Hefley, Aparna Bhave, Thomas Geisler, Darlene Philip
  • Publication number: 20060046215
    Abstract: The use of metal antimonates at high metal antimonate to binder ratios in buried backside conductive layers of thermographic and photothermographic materials allows the use of thin backside overcoat layers. The combination provides antistatic constructions having excellent antistatic properties that show less change in resistivity with changes in humidity. The thin backside overcoat layer serves to protect the buried antistatic layer.
    Type: Application
    Filed: August 31, 2004
    Publication date: March 2, 2006
    Inventors: Thomas Ludemann, Gary LaBelle, Darlene Philip, Roland Koestner, Aparna Bhave