Abstract: Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.

Abstract: Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.

Abstract: Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.

Abstract: Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.

Abstract: In one embodiment of the invention, a semiconductor component includes: a leadframe (110, 210, 310, 410) having a surface (111, 211, 311, 411); an integrated passive component (120, 220, 320, 420) located above the surface of the leadframe; a semiconductor chip (130, 230, 330, 430) electrically coupled to the integrated passive component and located above the surface of the leadframe; and a mold compound (140, 240, 340, 440) disposed around the semiconductor chip, the integrated passive component, and the leadframe. A portion (112, 212, 312, 412) of the leadframe is exposed outside of the mold compound. The integrated passive component comprises a passive device (121, 221, 321, 421). A direction (190, 290, 390, 490) perpendicular to the surface of the leadframe is a vertical direction, and the semiconductor chip, the integrated passive component, and the leadframe are arranged vertically with respect to each other.

Abstract: In one embodiment of the invention, a semiconductor component includes: a leadframe (110, 210, 310, 410) having a surface (111, 211, 311, 411); an integrated passive component (120, 220, 320, 420) located above the surface of the leadframe; a semiconductor chip (130, 230, 330, 430) electrically coupled to the integrated passive component and located above the surface of the leadframe; and a mold compound (140, 240, 340, 440) disposed around the semiconductor chip, the integrated passive component, and the leadframe. A portion (112, 212, 312, 412) of the leadframe is exposed outside of the mold compound. The integrated passive component comprises a passive device (121, 221, 321, 421). A direction (190, 290, 390, 490) perpendicular to the surface of the leadframe is a vertical direction, and the semiconductor chip, the integrated passive component, and the leadframe are arranged vertically with respect to each other.

Abstract: An exemplary method and apparatus for MEMS device control-chip integration and packaging comprises inter alia: a device substrate (300) comprising at least one MEMS device element (315) and at least a first interconnect pad (350); and a control-chip lid substrate (460) comprising at least a second interconnect pad (410), wherein the first interconnect pad (350) is suitably adapted for substantial engagement with the second interconnect pad (410) in order to communicably connect an integrated control chip (400) to a MEMS device element (315). Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve component density and/or form factor for any MEMS device. An exemplary embodiment of the present invention representatively provides for HV control-chip driver integration and packaging of RF MEMS switches.