Patents by Inventor Darrell Foote

Darrell Foote has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method using fluid pressure to remove back metal from semiconductor wafer scribe streets
    Patent number: 8906745
    Abstract: A method of dividing a semiconductor wafer in which a sheet of deformable material engaging the metal layer side of the wafer has pressurized fluid applied thereto to cause the metal layer to break at the locations of wafer scribe streets.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: December 9, 2014
    Assignee: Micro Processing Technology, Inc.
    Inventors: Paul C. Lindsey, Jr., Darrell Foote