Patents by Inventor Darrell Jacob Belmas

Darrell Jacob Belmas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for disengaging semiconductor die from an adhesive film
    Patent number: 6889427
    Abstract: An apparatus and method for separating a semiconductor die (303) from an adhesive tape (32) are disclosed. The apparatus includes a blade (34) mechanically coupled to a blade holder (36), wherein the blade (34) is inclined relative to the primary surface of the semiconductor die (303). The method further comprises lifting the semiconductor die (303) while it is attached to the adhesive tape (32) to assist disengagement. The blade (34) facilitates peeling of the semiconductor die (303) from the adhesive tape (32) while distributing stress exerted on the semiconductor die (303) over a larger surface area resulting in reduced die fractures (20).
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: May 10, 2005
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Lup Kweun Yee, Darrell Jacob Belmas
  • Process and apparatus for disengaging semiconductor die from an adhesive film
    Publication number: 20030154597
    Abstract: An apparatus and method for separating a semiconductor die (303) from an adhesive tape (32) are disclosed. The apparatus includes a blade (34) mechanically coupled to a blade holder (36), wherein the blade (34) is inclined relative to the primary surface of the semiconductor die (303). The method further comprises lifting the semiconductor die (303) while it is attached to the adhesive tape (32) to assist disengagement. The blade (34) facilitates peeling of the semiconductor die (303) from the adhesive tape (32) while distributing stress exerted on the semiconductor die (303) over a larger surface area resulting in reduced die fractures (20).
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Inventors: Lup Kweun Yee, Darrell Jacob Belmas