Patents by Inventor Darrell James

Darrell James has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12287687
    Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.
    Type: Grant
    Filed: September 19, 2023
    Date of Patent: April 29, 2025
    Assignee: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Publication number: 20240388627
    Abstract: A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable p
    Type: Application
    Filed: February 6, 2024
    Publication date: November 21, 2024
    Applicant: Arbor Company, LLLP
    Inventors: Darrel James Guzy, SR., Wei-Ti Liu, Darrel James Guzy, JR.
  • Publication number: 20240264648
    Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.
    Type: Application
    Filed: September 19, 2023
    Publication date: August 8, 2024
    Applicant: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Patent number: 11895191
    Abstract: A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable p
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: February 6, 2024
    Assignee: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Sr., Wei-Ti Liu, Darrel James Guzy, Jr.
  • Patent number: 11797067
    Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.
    Type: Grant
    Filed: August 1, 2022
    Date of Patent: October 24, 2023
    Assignee: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Patent number: 11762440
    Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.
    Type: Grant
    Filed: August 1, 2022
    Date of Patent: September 19, 2023
    Assignee: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Patent number: 11724861
    Abstract: A closure constructed for being inserted and securely retained in a portal-forming neck of a container, the closure having a substantially cylindrical shape and comprising substantially flat terminating surfaces forming the opposed ends of the closure, wherein the closure further comprises: (a) a closure precursor having a substantially cylindrical shape and comprising a lateral surface and substantially flat terminating surfaces forming the opposed ends of the closure precursor, wherein the lateral surface and the flat terminating surfaces of the closure precursor have a substantially uniform color; and (b) a decorative layer that at least partially covers at least the lateral surface of the closure precursor.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: August 15, 2023
    Assignee: VINVENTIONS USA, LLC
    Inventors: Darrell James Miller, Olav Marcus Aagaard, Christine Phi Phuong Duong
  • Patent number: 11669293
    Abstract: An electronic device is coupled to electronic paper display. The electronic device may be utilized as part of an industrial control system. The central processing unit programmatically and automatically updates the electronic paper display with information to be displayed.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: June 6, 2023
    Assignee: INTELLIGENT PLATFORMS, LLC
    Inventors: Darrell Lee Halterman, Darrell James Hatfield
  • Publication number: 20230100530
    Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.
    Type: Application
    Filed: August 1, 2022
    Publication date: March 30, 2023
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Publication number: 20220382697
    Abstract: A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable p
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Inventors: Darrel James Guzy, SR., Wei-Ti Liu, Darrel James Guzy, JR.
  • Patent number: 11463524
    Abstract: A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable p
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: October 4, 2022
    Assignee: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Sr., Wei-Ti Liu, Darrel James Guzy, Jr.
  • Patent number: 11435800
    Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: September 6, 2022
    Assignee: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Patent number: 11402886
    Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: August 2, 2022
    Assignee: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Publication number: 20220121257
    Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.
    Type: Application
    Filed: July 13, 2021
    Publication date: April 21, 2022
    Applicant: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Publication number: 20210409494
    Abstract: A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable p
    Type: Application
    Filed: June 15, 2021
    Publication date: December 30, 2021
    Applicant: Arbor Company, LLLP
    Inventors: Darrel James Guzy, SR., Wei-Ti Liu, Darrel James Guzy, JR.
  • Patent number: 11061455
    Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: July 13, 2021
    Assignee: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Patent number: 11047990
    Abstract: An antenna enclosure includes a sensor and a Global Navigation Satellite System (GNSS) antenna. Within the antenna enclosure, sensor data is combined with GNSS information to produce a RF communication signal, wherein the sensor data is out-of-band from the GNSS information. The RF communication signal is transmitted utilizing a GNSS antenna data link to a receiver side. On the receiver side, the RF communication signal is split into a GNSS RF path and a sensor RF path. The GNSS signals are transmitted to the GNSS receiver via the GNSS RF path. A sensor RF communication signal is de-modulated, and the sensor data is transmitted to the GNSS receiver. When the GNSS antenna data link is bi-directional, information may be transmitted from the GNSS receiver to the antenna enclosure via the GNSS antenna data link.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: June 29, 2021
    Assignee: NovAtel Inc.
    Inventors: Jerry Allan Freestone, Teresia Cheuk Wa Lee, Darrell James Anklovitch
  • Patent number: 10969977
    Abstract: An integrated circuit die element comprises one or more field-programmable gate arrays (FPGAs) elements; a reconfigurable dual function memory array, the reconfigurable dual function memory array including a plurality of reconfigurable memory array blocks, each reconfigurable memory array block being capable of configuration and reconfiguration as a storage memory array block or as a control logic array block for controlling at least a portion of the one or more FPGA elements; and a control logic circuit functioning to configure each reconfigurable memory array block as the respective memory array block or as the respective logic array block for controlling the one or more FPGA elements.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: April 6, 2021
    Assignee: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Publication number: 20210011641
    Abstract: An integrated circuit die element comprises one or more field-programmable gate arrays (FPGAs) elements; a reconfigurable dual function memory array, the reconfigurable dual function memory array including a plurality of reconfigurable memory array blocks, each reconfigurable memory array block being capable of configuration and reconfiguration as a storage memory array block or as a control logic array block for controlling at least a portion of the one or more FPGA elements; and a control logic circuit functioning to configure each reconfigurable memory array block as the respective memory array block or as the respective logic array block for controlling the one or more FPGA elements.
    Type: Application
    Filed: September 25, 2020
    Publication date: January 14, 2021
    Applicant: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu
  • Publication number: 20210004070
    Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.
    Type: Application
    Filed: September 22, 2020
    Publication date: January 7, 2021
    Applicant: Arbor Company, LLLP
    Inventors: Darrel James Guzy, Wei-Ti Liu