Patents by Inventor Darrell James
Darrell James has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12287687Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.Type: GrantFiled: September 19, 2023Date of Patent: April 29, 2025Assignee: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu
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Publication number: 20240388627Abstract: A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable pType: ApplicationFiled: February 6, 2024Publication date: November 21, 2024Applicant: Arbor Company, LLLPInventors: Darrel James Guzy, SR., Wei-Ti Liu, Darrel James Guzy, JR.
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Publication number: 20240264648Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.Type: ApplicationFiled: September 19, 2023Publication date: August 8, 2024Applicant: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu
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Patent number: 11895191Abstract: A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable pType: GrantFiled: August 9, 2022Date of Patent: February 6, 2024Assignee: Arbor Company, LLLPInventors: Darrel James Guzy, Sr., Wei-Ti Liu, Darrel James Guzy, Jr.
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Patent number: 11797067Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.Type: GrantFiled: August 1, 2022Date of Patent: October 24, 2023Assignee: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu
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Patent number: 11762440Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.Type: GrantFiled: August 1, 2022Date of Patent: September 19, 2023Assignee: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu
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Patent number: 11724861Abstract: A closure constructed for being inserted and securely retained in a portal-forming neck of a container, the closure having a substantially cylindrical shape and comprising substantially flat terminating surfaces forming the opposed ends of the closure, wherein the closure further comprises: (a) a closure precursor having a substantially cylindrical shape and comprising a lateral surface and substantially flat terminating surfaces forming the opposed ends of the closure precursor, wherein the lateral surface and the flat terminating surfaces of the closure precursor have a substantially uniform color; and (b) a decorative layer that at least partially covers at least the lateral surface of the closure precursor.Type: GrantFiled: August 29, 2019Date of Patent: August 15, 2023Assignee: VINVENTIONS USA, LLCInventors: Darrell James Miller, Olav Marcus Aagaard, Christine Phi Phuong Duong
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Patent number: 11669293Abstract: An electronic device is coupled to electronic paper display. The electronic device may be utilized as part of an industrial control system. The central processing unit programmatically and automatically updates the electronic paper display with information to be displayed.Type: GrantFiled: December 9, 2014Date of Patent: June 6, 2023Assignee: INTELLIGENT PLATFORMS, LLCInventors: Darrell Lee Halterman, Darrell James Hatfield
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Publication number: 20230100530Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.Type: ApplicationFiled: August 1, 2022Publication date: March 30, 2023Inventors: Darrel James Guzy, Wei-Ti Liu
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Publication number: 20220382697Abstract: A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable pType: ApplicationFiled: August 9, 2022Publication date: December 1, 2022Inventors: Darrel James Guzy, SR., Wei-Ti Liu, Darrel James Guzy, JR.
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Patent number: 11463524Abstract: A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable pType: GrantFiled: June 15, 2021Date of Patent: October 4, 2022Assignee: Arbor Company, LLLPInventors: Darrel James Guzy, Sr., Wei-Ti Liu, Darrel James Guzy, Jr.
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Patent number: 11435800Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.Type: GrantFiled: July 13, 2021Date of Patent: September 6, 2022Assignee: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu
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Patent number: 11402886Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.Type: GrantFiled: July 13, 2021Date of Patent: August 2, 2022Assignee: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu
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Publication number: 20220121257Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.Type: ApplicationFiled: July 13, 2021Publication date: April 21, 2022Applicant: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu
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Publication number: 20210409494Abstract: A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable pType: ApplicationFiled: June 15, 2021Publication date: December 30, 2021Applicant: Arbor Company, LLLPInventors: Darrel James Guzy, SR., Wei-Ti Liu, Darrel James Guzy, JR.
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Patent number: 11061455Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.Type: GrantFiled: September 22, 2020Date of Patent: July 13, 2021Assignee: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu
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Patent number: 11047990Abstract: An antenna enclosure includes a sensor and a Global Navigation Satellite System (GNSS) antenna. Within the antenna enclosure, sensor data is combined with GNSS information to produce a RF communication signal, wherein the sensor data is out-of-band from the GNSS information. The RF communication signal is transmitted utilizing a GNSS antenna data link to a receiver side. On the receiver side, the RF communication signal is split into a GNSS RF path and a sensor RF path. The GNSS signals are transmitted to the GNSS receiver via the GNSS RF path. A sensor RF communication signal is de-modulated, and the sensor data is transmitted to the GNSS receiver. When the GNSS antenna data link is bi-directional, information may be transmitted from the GNSS receiver to the antenna enclosure via the GNSS antenna data link.Type: GrantFiled: November 21, 2018Date of Patent: June 29, 2021Assignee: NovAtel Inc.Inventors: Jerry Allan Freestone, Teresia Cheuk Wa Lee, Darrell James Anklovitch
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Patent number: 10969977Abstract: An integrated circuit die element comprises one or more field-programmable gate arrays (FPGAs) elements; a reconfigurable dual function memory array, the reconfigurable dual function memory array including a plurality of reconfigurable memory array blocks, each reconfigurable memory array block being capable of configuration and reconfiguration as a storage memory array block or as a control logic array block for controlling at least a portion of the one or more FPGA elements; and a control logic circuit functioning to configure each reconfigurable memory array block as the respective memory array block or as the respective logic array block for controlling the one or more FPGA elements.Type: GrantFiled: September 25, 2020Date of Patent: April 6, 2021Assignee: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu
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Publication number: 20210011641Abstract: An integrated circuit die element comprises one or more field-programmable gate arrays (FPGAs) elements; a reconfigurable dual function memory array, the reconfigurable dual function memory array including a plurality of reconfigurable memory array blocks, each reconfigurable memory array block being capable of configuration and reconfiguration as a storage memory array block or as a control logic array block for controlling at least a portion of the one or more FPGA elements; and a control logic circuit functioning to configure each reconfigurable memory array block as the respective memory array block or as the respective logic array block for controlling the one or more FPGA elements.Type: ApplicationFiled: September 25, 2020Publication date: January 14, 2021Applicant: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu
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Publication number: 20210004070Abstract: A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.Type: ApplicationFiled: September 22, 2020Publication date: January 7, 2021Applicant: Arbor Company, LLLPInventors: Darrel James Guzy, Wei-Ti Liu