Abstract: A structural subassembly for use in an information handling system chassis may include a first portion, a second portion, a common wall, and one or more mechanical features. The first portion may be configured to receive one or more of a first type of information handling resource. The second portion may be configured to receive one or more of a second type of information handling resource. The common wall may divide the first portion from the second portion. The one or more mechanical features may be configured to engage with one or more respective mechanical features of the information handling system chassis in order to perform at least one of guiding of the subassembly relative to the information handling system chassis during insertion or removal of the subassembly into or from the information handling system chassis and retention of the subassembly relative to the information handling system chassis.

Abstract: In accordance with these and other embodiments of the present disclosure, a system may include a top plate, a bottom plate mechanically coupled to the top plate; a plurality of first connectors and a second connector. The plurality of first connectors may be located on an exterior surface of the top plate such that each of the plurality of first connectors is configured to electrically couple to a corresponding connector of an information handling resource as the information handling resource is mechanically supported by the top plate. The second connector may be electrically coupled to each of the plurality of first connectors and may be located on an exterior surface of the bottom plate such that the second connector is configured to electrically couple to a circuit board.

Abstract: In accordance with these and other embodiments of the present disclosure, a system may include a top plate, a bottom plate mechanically coupled to the top plate; a plurality of first connectors and a second connector. The plurality of first connectors may be located on an exterior surface of the top plate such that each of the plurality of first connectors is configured to electrically couple to a corresponding connector of an information handling resource as the information handling resource is mechanically supported by the top plate. The second connector may be electrically coupled to each of the plurality of first connectors and may be located on an exterior surface of the bottom plate such that the second connector is configured to electrically couple to a circuit board.

Abstract: a structural subassembly for use in an information handling system chassis may include a first portion, a second portion, a common wall, and one or more mechanical features. The first portion may be configured to receive one or more of a first type of information handling resource. The second portion may be configured to receive one or more of a second type of information handling resource. The common wall may divide the first portion from the second portion. The one or more mechanical features may be configured to engage with one or more respective mechanical features of the information handling system chassis in order to perform at least one of guiding of the subassembly relative to the information handling system chassis during insertion or removal of the subassembly into or from the information handling system chassis and retention of the subassembly relative to the information handling system chassis.

Abstract: Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing components. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.

Abstract: Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing components. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.

Abstract: Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing component. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.

Abstract: A memory device latching system includes a processor. A plurality of memory devices are coupled to the processor through respective memory sockets. A first memory socket includes a first latch member having a first latch actuation member and defining a second latch member channel. A second memory socket includes a second latch member having a second latch actuation member and defining a first latch member channel. The first memory socket and the second memory socket are mounted to a circuit board such that the first latch end is located adjacent the second latch end, and the first latch member and the second latch member are operable to move to open positions such that at least a portion of the first latch actuation member is located in the first latch member channel and at least a portion of the second latch actuation member is located in the second latch member channel.

Abstract: A multiple component mounting system includes a first carrier including a base. A plurality of first component coupling members are located on the base and define a first component channel. At least one of the first component coupling members include a first resilient member that is operable to engage a first component when the first component is located in the first component channel in order to secure the first component to the base free of the use of a tool. A plurality of second component coupling members are located on the base and define a second component channel. At least one of the second component coupling members include a second resilient member that is operable to engage a second component when the second component is located in the second component channel in order to secure the second component to the base free of the use of a tool.

Abstract: A multiple component mounting system includes a first carrier including a base. A plurality of first component coupling members are located on the base and define a first component channel. At least one of the first component coupling members include a first resilient member that is operable to engage a first component when the first component is located in the first component channel in order to secure the first component to the base free of the use of a tool. A plurality of second component coupling members are located on the base and define a second component channel. At least one of the second component coupling members include a second resilient member that is operable to engage a second component when the second component is located in the second component channel in order to secure the second component to the base free of the use of a tool.

Abstract: An air directing apparatus includes a first air directing member defining a component access passageway. A second air directing member is moveably coupled to the first air directing member, whereby the second air directing member is moveable relative to the first air directing member into a first position and a second position, wherein with the second air directing member in the first position the component access passageway is substantially obstructed and with the second air directing member in the second position the component access passageway is substantially unobstructed.

Abstract: An air directing apparatus includes a first air directing member defining a component access passageway. A second air directing member is moveably coupled to the first air directing member, whereby the second air directing member is moveable relative to the first air directing member into a first position and a second position, wherein with the second air directing member in the first position the component access passageway is substantially obstructed and with the second air directing member in the second position the component access passageway is substantially unobstructed.

Abstract: A modular component coupling apparatus includes a chassis defining a chassis housing. A modular component mounting member is pivotally coupled to the chassis, wherein the modular component mounting member defines a modular component housing, whereby the modular component mounting member is operable to pivot relative to the chassis between a first position that is outside of the chassis housing and a second position that is within the chassis housing.

Abstract: Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing component. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.

Abstract: A heat sink retention apparatus includes a base member and a heat sink mount including a pivotal base coupler and a board mounting member, whereby the heat sink mount is operable to mount to a board by engaging the pivotal base coupler with the base member and engaging the board mounting member with the board. A cable routing member and a connector storage member may be included on the heat sink mount for the routing of cables and the storing of connectors. A card retention device may be provided which is operable to couple to the heat sink mount and engage a card to retain the card on the board.

Abstract: A chassis bushing assembly is provided. The chassis bushing assembly includes an outer disc and an inner disc. The outer disc includes a lip and has first face and a second face. The inner disc includes a shoulder and has a third face and a fourth face. In addition, the inner disc coaxially mates with the outer disc. The chassis bushing assembly further includes a first aperture extending through the first and second faces of the outer disc and a second aperture, coaxially located with respect to the first aperture, extending through the third and fourth faces of the inner disc. The chassis bushing assembly is symmetrical so that each chassis bushing location within a chassis utilizes the same chassis bushing assembly. In addition, the chassis bushing assembly is common across different chassis types and backwards compatibly with previous chassis designs.

Abstract: A chassis bushing assembly is provided. The chassis bushing assembly includes an outer disc and an inner disc. The outer disc includes a lip and has first face and a second face. The inner disc includes a shoulder and has a third face and a fourth face. In addition, the inner disc coaxially mates with the outer disc. The chassis bushing assembly further includes a first aperture extending through the first and second faces of the outer disc and a second aperture, coaxially located with respect to the first aperture, extending through the third and fourth faces of the inner disc. The chassis bushing assembly is symmetrical so that each chassis bushing location within a chassis utilizes the same chassis bushing assembly. In addition, the chassis bushing assembly is common across different chassis types and backwards compatibly with previous chassis designs.

Abstract: An apparatus for applying decalcomania to a curved surface of a container is provided. The apparatus includes a base, first and second curved rigid support members pivotally connected with respect to each other, a band mounted to the end portion of each support member, a heater assembly supported within the band, and a handle linkage adapted to open and close the support members with respect to each other. Movement of the handle linkage causes one support member to close with respect to the other support member, thereby tightening the band and heater assembly about a container for application of the decalcomania. A turn-buckle type adjustment is provided for adjusting pressure applied by the handle linkage.