Abstract: A transceiver assembly includes a frame section, a rigid printed circuit board, a flex circuit, and an edge connector. The frame section includes a flex circuit layer for use in carrying data, and control and power signals, and an optoelectronic device. The rigid printed circuit board includes a first rigid printed circuit board layer and a flex circuit layer for use in carrying data, and control and power signals. The flex circuit is for carrying data, and control and power signals which flexibly links the rigid printed circuit board to the frame section and forms the flex circuit layers in the rigid printed circuit board and the frame section. The edge connector is formed on one end of the printed circuit board by a plurality of connection pads disposed along one edge of the printed circuit board.

Abstract: A transceiver assembly includes a frame section, a rigid circuit board, a flex circuit, and a controller chip. The frame section includes an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to the set of photoactive components, and a flex circuit layer. The rigid circuit board includes a first rigid printed circuit board layer, a second rigid printed circuit board layer, and a flex circuit layer. The flex circuit also forms the flex circuit layers in the rigid circuit board and the frame section. The flex circuit is adapted for electrically coupling the first and second printed circuit board layers in the rigid circuit board to the frame section. The controller chip is mounted on a surface of the first rigid printed circuit board layer.

Abstract: A frame section includes a flex circuit layer, a support layer, and a silicon substrate carrier. The flex circuit layer includes a plurality of communication lines and having a flex circuit window section. The support layer includes a support layer window smaller that the flex circuit window section so as to define an inwardly extending support shelf. The silicon substrate carrier is mounted on the support shelf in the support layer window and includes an optoelectronic device supported on the silicon substrate carrier. The optoelectronic device includes a set of photoactive components. The frame section is used for supporting the optoelectronic device within a fiber optic transceiver assembly which in turn is used for connecting to a fiber optic ferrule supporting a set of fiber optic communication fibers.

Abstract: A transceiver assembly includes a frame section, a rigid printed circuit board, a flex circuit, and an edge connector. The frame section includes a flex circuit layer for use in carrying data, and control and power signals, and an optoelectronic device. The rigid printed circuit board includes a first rigid printed circuit board layer and a flex circuit layer for use in carrying data, and control and power signals. The flex circuit is for carrying data, and control and power signals which flexibly links the rigid printed circuit board to the frame section and forms the flex circuit layers in the rigid printed circuit board and the frame section. The edge connector is formed on one end of the printed circuit board by a plurality of connection pads disposed along one edge of the printed circuit board.

Abstract: A frame section includes a flex circuit layer, a support layer, and a silicon substrate carrier. The flex circuit layer includes a plurality of communication lines and having a flex circuit window section. The support layer includes a support layer window smaller that the flex circuit window section so as to define an inwardly extending support shelf. The silicon substrate carrier is mounted on the support shelf in the support layer window and includes an optoelectronic device supported on the silicon substrate carrier. The optoelectronic device includes a set of photoactive components. The frame section is used for supporting the optoelectronic device within a fiber optic transceiver assembly which in turn is used for connecting to a fiber optic ferrule supporting a set of fiber optic communication fibers.

Abstract: A transceiver assembly includes a frame section, a rigid circuit board, a flex circuit, and a controller chip. The frame section includes an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to the set of photoactive components, and a flex circuit layer. The rigid circuit board includes a first rigid printed circuit board layer, a second rigid printed circuit board layer, and a flex circuit layer. The flex circuit also forms the flex circuit layers in the rigid circuit board and the frame section. The flex circuit is adapted for electrically coupling the first and second printed circuit board layers in the rigid circuit board to the frame section. The controller chip is mounted on a surface of the first rigid printed circuit board layer.

Abstract: An optoelectronic subassembly includes a planar substrate, a set of guide pins, and a support block. The planar substrate has an array of photoactive components mounted on the planar substrate and a set of apertures in the planar substrate are aligned with the photoactive components. The set of guide pins have proximal and distal ends extending through the set of apertures in the planar substrate. The support block includes a set of support passages in which the distal ends of the guide pins are cemented, and a support face which is at right angles to the set of support passages. The optoelectronic subassembly is for use in a fiber optic communications transceiver which is adapted for being mechanically and optically connected to an optical ferrule. The optical ferrule supports an array of optical communications fibers.

Abstract: A transceiver assembly for use in fiber optic communications systems where multiple optical fibers are used in transmitting and receiving optical signals. The assembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The transceiver assembly supports an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The transceiver assembly includes a frame section having a carrier which is precisely fabricated for supporting the optoelectronic device and includes an alignment structure for cooperating with the optical ferrule to align the photoactive components with the fibers in the ferrule.

Abstract: Reverse bias leakage testing may be used to determine the health of a vertical cavity surface emitting laser (VCSEL). When VCSELs are integrated on a die with other electronic devices such testing may damage the other electronic devices or be prohibited by circuits on the die designed to protect the electronics from being reverse biased. Accordingly, reverse bias testing may be facilitated by providing a second ground pad, separate from the die ground pad, specific to the VCSEL.

Abstract: An optical fiber connector for releasably coupling an optical fiber to an electro-optical module is disclosed. The optical fiber connector includes a housing, a strain relief, a fiber retention clip, and a pair of latching arms. The housing includes a housing bore defined through at least a portion of the housing and adapted to accommodate the exterior diameter of a typical optical fiber. The optical fiber extending through the strain relief and into the housing bore, terminating at an end of the housing. The optical fiber is retained by the housing by the utilization of the fiber retention clip. The latching arms are arranged to releasable attach the connector to an electro-optical device such that the optical fiber and an optical lens disposed in the electro-optical device are aligned.

Abstract: A transceiver is disclosed. The transceiver includes a carrier assembly having active components to transmit and receive optical input/output (I/O); and a connector, coupled to the carrier assembly to couple optical I/O between the active components and a waveguide.

Abstract: A connector is disclosed. The connector includes a floating component to receive a first set of optical waveguides, and a fixed component to receive a second set of optical waveguides and to facilitate optical alignment between the first set of waveguides and the second set of waveguides through automated alignments with the floating component.

Abstract: A circuit package includes a circuit substrate having a cutout portion defined therein, an interconnect electrically coupled to the circuit substrate and an active circuit component disposed off the circuit substrate within the cutout portion and electrically coupled to the interconnect. An optical circuit includes a lead frame and an optical component electrically coupled to the lead frame. The lead frame includes a first lead portion at a first level having an upper surface and a lower surface, and a second lead portion at a second level lower than the first level and electrically connected to the first lead portion. The lower surface of the first lead portion is arranged to electrically connect to a surface of a circuit substrate. The second lead portion includes an upper surface and a lower surface. The optical component is disposed on the upper surface of the second lead portion.

Abstract: A parallel optics module including singulated dies. A first singulated die includes a first semiconductor optical component, and a second die includes a second semiconductor optical component. The first and second dies are mounted to a substrate. The first and second dies to be integrated into a parallel optics module.

Abstract: The internal surface (2) of an aircraft wing skin panel (1) in the wing box comprises a multiplicity of strips (3), each strip being associated with a stringer. The strips (3) have different gradients in the span-wise direction S, which is the direction in which the strips extend. The surface of each strip is, in the chord-wise direction C, parallel to the external surface (5). At a junction, at which a rib meets a stringer, the interior surface (2) has an area (4a) that is parallel to the exterior surface (5), such that the rib and stringer at that junction may be simply attached to the wing skin panel (1). Manufacture and design of wing skins and wing boxes may be greatly simplified by means of defining the interior surface with such strips.

Abstract: A lens array for use in fiber optic communications modules where multiple optical fibers are used in either transmitting or receiving optical signals. The lens array is adapted for optically interfacing a set of photoactive components such as semiconductor lasers or photo diodes deployed on an integrated circuit chip with a set of optical communications fibers supported in a ferrule. The individual lens elements within the array are shaped to have a greater height than width and are fitted together by being truncated along their boundaries with adjoining lenses. The increased height of the lens elements allows them to gather and transfer more light between the photoactive components and the optical fibers.

Abstract: A subassembly for use in fiber optic communications systems where multiple optical fibers are used in either transmitting or receiving optical signals. The subassembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The subassembly uses a carrier assembly to support an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The subassembly includes a lens and alignment frame having a set of guide pins and an array of lenses for interfacing the fibers of the ferrule with the photoactive components of the optoelectronic device on the carrier assembly. The carrier assembly may also include signal processing devices and a circuit board having an edge connector for removably connecting the subassembly with a computer or communications system.

Abstract: A lens array for use in fiber optic communications modules where multiple optical fibers are used in either transmitting or receiving optical signals. The lens array is adapted for optically interfacing a set of photoactive components such as semiconductor lasers or photo diodes deployed on an integrated circuit chip with a set of optical communications fibers supported in a ferrule. The individual lens elements within the array are shaped to have a greater height than width and are fitted together by being truncated along their boundaries with adjoining lenses. The increased height of the lens elements allows them to gather and transfer more light between the photoactive components and the optical fibers.

Abstract: A subassembly for use in fiber optic communications systems where multiple optical fibers are used in either transmitting or receiving optical signals. The subassembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The subassembly uses a carrier assembly to support an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The subassembly includes a lens and alignment frame having a set of guide pins and an array of lenses for interfacing the fibers of the ferrule with the photoactive components of the optoelectronic device on the carrier assembly. The carrier assembly may also include signal processing devices and a circuit board having an edge connector for removably connecting the subassembly with a computer or communications system.

Abstract: A transceiver assembly for use in fiber optic communications systems where multiple optical fibers are used in transmitting and receiving optical signals. The assembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The transceiver assembly supports an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The transceiver assembly includes a frame section having a carrier which is precisely fabricated for supporting the optoelectronic device and includes an alignment structure for cooperating with the optical ferrule to align the photoactive components with the fibers in the ferrule.