Patents by Inventor Darren DeNardis

Darren DeNardis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing apparatus and method of polishing work piece
    Patent number: 7195546
    Abstract: The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel; a polishing plate provided in the pressure vessel; a pressing plate pressing a work piece onto the polishing plate; a driving unit relatively moving the polishing plate with respect to the pressing plate so as to polish the work piece; a gas supplying source supplying an alkaline gas or an acid gas into the pressure vessel; a gas discharging section discharging the supplied gas from the pressure vessel; and a slurry supplying unit supplying slurry onto the polishing plate. A pH value of the slurry is adjusted by dissolving the alkaline gas or the acid gas in the slurry.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: March 27, 2007
    Assignees: Fujikoshi Machinery Corp.
    Inventors: Toshiro Doi, Ara Philipossian, Darren DeNardis
  • Polishing apparatus and method of polishing work piece
    Publication number: 20060217039
    Abstract: The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel; a polishing plate provided in the pressure vessel; a pressing plate pressing a work piece onto the polishing plate; a driving unit relatively moving the polishing plate with respect to the pressing plate so as to polish the work piece; a gas supplying source supplying an alkaline gas or an acid gas into the pressure vessel; a gas discharging section discharging the supplied gas from the pressure vessel; and a slurry supplying unit supplying slurry onto the polishing plate. A pH value of the slurry is adjusted by dissolving the alkaline gas or the acid gas in the slurry.
    Type: Application
    Filed: May 30, 2006
    Publication date: September 28, 2006
    Applicants: Toshiro DOI, Fujikoshi Machinery Corp.
    Inventors: Toshiro Doi, Ara Philipossian, Darren DeNardis
  • Polishing apparatus and method of polishing work piece
    Patent number: 7070486
    Abstract: The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel; a polishing plate provided in the pressure vessel; a pressing plate pressing a work piece onto the polishing plate; a driving unit relatively moving the polishing plate with respect to the pressing plate so as to polish the work piece; a gas supplying source supplying an alkaline gas or an acid gas into the pressure vessel; a gas discharging section discharging the supplied gas from the pressure vessel; and a slurry supplying unit supplying slurry onto the polishing plate. A pH value of the slurry is adjusted by dissolving the alkaline gas or the acid gas in the slurry.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: July 4, 2006
    Assignees: Toshiro DOY, Fujikoshi Machinery Corp.
    Inventors: Toshiro Doi, Ara Philipossian, Darren DeNardis
  • Polishing apparatus and method of polishing work piece
    Publication number: 20050113007
    Abstract: The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel; a polishing plate provided in the pressure vessel; a pressing plate pressing a work piece onto the polishing plate; a driving unit relatively moving the polishing plate with respect to the pressing plate so as to polish the work piece; a gas supplying source supplying an alkaline gas or an acid gas into the pressure vessel; a gas discharging section discharging the supplied gas from the pressure vessel; and a slurry supplying unit supplying slurry onto the polishing plate. A pH value of the slurry is adjusted by dissolving the alkaline gas or the acid gas in the slurry.
    Type: Application
    Filed: November 18, 2004
    Publication date: May 26, 2005
    Applicants: Fujikoshi Machinery Corp.
    Inventors: Toshiro Doi, Ara Philipossian, Darren DeNardis