Abstract: Method and apparatus for managing data in a memory, such as a flash memory array. In accordance with some embodiments, a test pattern is written to a selected block of solid-state non-volatile memory cells. The test pattern is read from the selected block and a total number of read errors is identified. A data retention time is determined in response to the total number of read errors and an elapsed time interval between the writing of the test pattern and the reading of the test pattern. Data in a second block of the solid-state non-volatile memory cells are thereafter refreshed in relation to the determined data retention time.

Abstract: Method and apparatus for managing data in a memory, such as a flash memory array. In accordance with some embodiments, a test pattern is written to a selected block of solid-state non-volatile memory cells. The test pattern is read from the selected block and a total number of read errors is identified. A data retention time is determined in response to the total number of read errors and an elapsed time interval between the writing of the test pattern and the reading of the test pattern. Data in a second block of the solid-state non-volatile memory cells are thereafter refreshed in relation to the determined data retention time.

Abstract: A solid state data storage assembly includes thermal interface material that conducts heat away from electrical components of the assembly. In some examples, the thermal interface material is positioned between a printed circuit board assembly, which includes electrical components, and a cover of a housing of the data storage assembly. The thermal interface material may also provide shock protection for the data storage assembly by at least one of increasing a stiffness of the data storage assembly, absorbing some mechanical loads applied to the data storage assembly or distributing the applied loads. In addition, in some examples, the thermal interface material exhibits some tackiness, such that removal of a thermal interface material from a data storage assembly and subsequent repositioning of the thermal interface material within the data storage assembly may provide a visual indication of tampering.

Abstract: A solid state data storage assembly includes thermal interface material that conducts heat away from electrical components of the assembly. In some examples, the thermal interface material is positioned between a printed circuit board assembly, which includes electrical components, and a cover of a housing of the data storage assembly. The thermal interface material may also provide shock protection for the data storage assembly by at least one of increasing a stiffness of the data storage assembly, absorbing some mechanical loads applied to the data storage assembly or distributing the applied loads. In addition, in some examples, the thermal interface material exhibits some tackiness, such that removal of a thermal interface material from a data storage assembly and subsequent repositioning of the thermal interface material within the data storage assembly may provide a visual indication of tampering.