Patents by Inventor Darren Janzig

Darren Janzig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240100323
    Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
  • Patent number: 11890484
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: February 6, 2024
    Assignee: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • Patent number: 11872392
    Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: January 16, 2024
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
  • Patent number: 11752351
    Abstract: Seals used within lead bores of implantable medical devices for creating a seal to implantable medical leads inserted into the lead bores include a cylinder that engages the lead body. The length of contact of the cylinder to the lead body is at least 0.010? long while average contact pressure is no greater than (10 pounds per inch)/(contact length). Adequate electrical isolation is achieved, even when a debris particle is present between the inner cylinder and the lead body while insertion force remains acceptable.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: September 12, 2023
    Assignee: MEDTRONIC, INC.
    Inventors: Richard T. Stone, Michael T. Hegland, Darren A. Janzig, Dale F. Seeley, Sean P. Skubitz, Ryan Davis, Salil M. Vaidya
  • Patent number: 11666767
    Abstract: A method of forming a medical device lead connection element is described. The method includes positioning an end portion of a lead filar to overlap a lead end connection element such that the positioning creates mutual interference between the lead filar and the lead end connection element, and forming an interference configuration. Then melting the end portion of the lead filar to form a weld joint and allowint the end portion of the lead filar to move towards the end connection element.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: June 6, 2023
    Assignee: Medtronic, Inc.
    Inventors: Darren Janzig, Robert J. Davies, Seth M. Humphrys, Richard T. Stone
  • Publication number: 20230127724
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 27, 2023
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • Publication number: 20230109958
    Abstract: Devices, systems, and methods for crimping a medical device are disclosed. More specifically, the present disclosure relates to devices, systems, and methods for reducing the diameter of a collapsible heart valve prosthesis to be loaded onto a delivery device. The devices, systems, and methods using at least one funnel to crimp the heart valve prosthesis and load it onto the delivery system.
    Type: Application
    Filed: November 4, 2022
    Publication date: April 13, 2023
    Inventors: Niall DUFFY, Marian LALLY, Philip HAARSTAD, Frank HAREWOOD, Igor KOVALSKY, Jason QUILL, Daniel GELFMAN, Ana MENK, Darren JANZIG, Shyam GOKALDAS, Kenneth Dale WARNOCK, JR.
  • Patent number: 11588213
    Abstract: Implantable medical devices that include a battery to power circuitry utilize a battery connector to electrically interconnect the battery to the circuitry. The battery connector may be mounted directly to a device housing to have the battery connector a fixed position within the device. Battery terminals of the battery are electrically connected to terminals on the battery connector, and the terminals on the battery connector are electrically connected to power terminals of the circuitry. The battery connector may include various features such as mounting grooves formed in a connector body, tapered pins to connect to power terminals on a circuit board, as well as plates to engage the battery terminals. The device housing may provide mounting features that allow the battery connector to be affixed directly to the device housing.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: February 21, 2023
    Assignee: MEDTRONIC, INC.
    Inventors: Steven Deininger, Jeffrey Clayton, Randy Roles, Darren Janzig, Paul Eichstaedt
  • Patent number: 11559695
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: January 24, 2023
    Assignee: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • Patent number: 11559694
    Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: January 24, 2023
    Assignee: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Publication number: 20230009502
    Abstract: A electrical contact for coupling a contact of a medical lead with electronics of a medical device including a contact member having a ring shaped wall defined by a ring inner diameter and ring outer diameter, a housing having a ring shape defining an opening therein, the opening configured to receive the medical lead therein, wherein the housing is defined in part by a housing longitudinal axis and a housing inner diameter, the contact member having at least one deflectable finger extending from the ring shaped wall into a contact opening defined by the ring inner diameter of the ring shaped wall, wherein the finger extends to a distal end and has side edges, the side edges of the finger disposed at respective angles relative to the housing longitudinal axis.
    Type: Application
    Filed: June 22, 2022
    Publication date: January 12, 2023
    Inventors: Damian M. Becker, Bernard Q. Li, Darren A. Janzig, Thomas J. Conway
  • Patent number: 11491339
    Abstract: Seals used within lead bores of implantable medical devices for creating a seal to implantable medical leads inserted into the lead bores include an inner cylinder that engages the lead body. The inner cylinder is surrounded by a gap to either an outer cylinder of the seal or to surrounding structures of the implantable medical device. The inner cylinder has freedom of movement within the gap such that movement of the lead body that is off-axis relative to a centerline of the lead bore causes movement of the inner cylinder that is providing the seal. In this manner, the seal engagement to the lead body is maintained during this off-axis movement of the lead body.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: November 8, 2022
    Assignee: MEDTRONIC, INC.
    Inventors: Steven T. Deininger, Jeffrey Clayton, Thomas M. Hillebrand, Jenna George, Bin Wang, Michael T. Hegland, Darren A. Janzig, Sean P. Skubitz, Richard T. Stone, Dale F. Seeley, Salil M. Vaidya
  • Patent number: 11491036
    Abstract: Devices, systems, and methods for crimping a medical device are disclosed. More specifically, the present disclosure relates to devices, systems, and methods for reducing the diameter of a collapsible heart valve prosthesis to be loaded onto a delivery device. The devices, systems, and methods using at least one funnel to crimp the heart valve prosthesis and load it onto the delivery system.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: November 8, 2022
    Assignee: MEDTRONIC VASCULAR GALWAY
    Inventors: Niall Duffy, Marian Lally, Philip Haarstad, Frank Harewood, Igor Kovalsky, Jason Quill, Daniel Gelfman, Ana Menk, Darren Janzig, Shyam Gokaldas, Kenneth Dale Warnock, Jr.
  • Patent number: 11426514
    Abstract: The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: August 30, 2022
    Assignee: Medtronic, Inc.
    Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
  • Publication number: 20220080188
    Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
    Type: Application
    Filed: November 29, 2021
    Publication date: March 17, 2022
    Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
  • Patent number: 11213673
    Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: January 4, 2022
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
  • Patent number: 11154721
    Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: October 26, 2021
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
  • Patent number: 11154713
    Abstract: An implantable segmented electrode structure may be configured to conduct electrical signals between elongated conductors of an implantable medical lead and respective portions of tissue of a patient. The implantable medical lead may extend from an implantable medical device that is implanted within the patient. The segmented electrode structure includes a plurality of separate electrode surfaces. The electrode surfaces are at a plurality of different axial positions and angular positions within the implantable segmented electrode structure. The segmented electrode structure additionally includes a plurality of prongs. The prongs extend axially from a proximal end of the segmented electrode structure through the segmented electrode structure. Each prong may electrically connect to one of the electrode surfaces. The prongs may terminate distally at respective electrode surfaces. Each prong may be configured to electrically connect to one of the elongated conductors.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: October 26, 2021
    Assignee: Medtronic, Inc.
    Inventors: Richard T. Stone, Robert J. Davies, Seth M. Humphrys, Darren A. Janzig
  • Publication number: 20210290375
    Abstract: Devices, systems, and methods for crimping a medical device are disclosed. More specifically, the present disclosure relates to devices, systems, and methods for reducing the diameter of a collapsible heart valve prosthesis to be loaded onto a delivery device. The devices, systems, and methods using at least one funnel to crimp the heart valve prosthesis and load it onto the delivery system.
    Type: Application
    Filed: April 9, 2021
    Publication date: September 23, 2021
    Inventors: Niall DUFFY, Marian LALLY, Philip HAARSTAD, Frank HAREWOOD, Igor KOVALSKY, Jason QUILL, Daniel GELFMAN, Ana MENK, Darren JANZIG, Shyam GOKALDAS, Kenneth Dale WARNOCK, JR.
  • Patent number: 11110284
    Abstract: A medical device lead connection assembly includes an end connector element including a plurality of fixed connection element tabs extending from the end connector element to a tab distal end. A lead body includes a plurality of lead filars extending through the lead body and coupled to a corresponding fixed connection tab. A tubular guide hub extends from a hub proximal end to a hub distal end. The tubular guide hub includes a plurality of guide elements circumferentially disposed about an outer surface of the guide hub. The hub distal end is disposed within the lead body and the hub proximal end received within connection element tabs, and selected guide elements contact selected lead filars.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: September 7, 2021
    Assignee: Medtronic, Inc.
    Inventors: Darren Janzig, Robert J. Davies, Seth M. Humphrys, Richard T. Stone