Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to charge trap memory devices and methods of manufacture and operation. The semiconductor memory includes: a charge trap transistor comprising a gate structure, a source region and a drain region; and a self-heating circuit which selectively applies an alternating bias direction between the source region and the drain region of the charge trap transistor to provide an erase operation or a programming operation of the charge trap transistor.

Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to charge trap memory devices and methods of manufacture and operation. The semiconductor memory includes: a charge trap transistor comprising a gate structure, a source region and a drain region; and a self-heating circuit which selectively applies an alternating bias direction between the source region and the drain region of the charge trap transistor to provide an erase operation or a programming operation of the charge trap transistor.

Abstract: The present disclosure relates to a structure including a voltage selection circuit which includes a first device and a second device, the voltage selection circuit is configured to output a higher voltage of a first supply voltage and a second supply voltage through one of the first device and the second device, and a voltage difference between the first supply voltage and the second supply voltage is less than a threshold voltage.

Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to program and erase memory structures and methods of manufacture. The semiconductor memory includes: a charge trap transistor; and a self-heating circuit which selectively applies voltages to terminals of the charge trap transistor to assist in erase operations of the charge trap transistor.

Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to program and erase memory structures and methods of manufacture. The semiconductor memory includes: a charge trap transistor; and a self-heating circuit which selectively applies voltages to terminals of the charge trap transistor to assist in erase operations of the charge trap transistor.

Abstract: A latching current sensing amplifier circuit for memory arrays and a current sensing technique using the latching current sensing amplifier circuit are provided. The current sense-amplifier circuit includes a first and second pair of series connected transistors configured with a common gate node for a sense operation and reconfigurable as a cross-coupled pair for a latching operation.

Abstract: The present disclosure relates to a structure which includes a pair of non-volatile storage devices in a memory array which are sensed to determine an initial data state and reinforced by a write operation of the initial data state to the pair of non-volatile storage devices. The structure can be used for a robust and error free physical unclonable function.

Abstract: The present disclosure relates to a structure which includes a twin-cell memory which includes a first device and a second device and which is configured to store data which corresponds to a threshold voltage difference between the first device controlled by a first wordline and the second device controlled by a second wordline.

Abstract: The present disclosure relates to a structure which includes a twin-cell memory which includes a first device and a second device and which is configured to store data which corresponds to a threshold voltage difference between the first device controlled by a first wordline and the second device controlled by a second wordline.

Abstract: The present disclosure relates to a structure which includes a twin-cell memory which is configured to program a plurality of write operations, a current sense amplifier which is connected to the twin-cell memory and is configured to sense a current differential and latch a differential voltage based on the current differential, and at least one current source which is connected to the current sense amplifier and is configured to add an offset current to the current sense amplifier to create the differential voltage.

Abstract: The present disclosure relates to a method of a non-volatile one time programmable memory (OTPM) including parallel programming of all banks of the OTPM by programming two rows per bank at a time, verifying the programming by comparing a first row of the two rows per bank, and verifying the programming by comparing a second row of the two rows per bank.

Abstract: The present disclosure relates to a structure which includes a twin-cell memory which is configured to program a plurality of write operations, a current sense amplifier which is connected to the twin-cell memory and is configured to sense a current differential and latch a differential voltage based on the current differential, and at least one current source which is connected to the current sense amplifier and is configured to add an offset current to the current sense amplifier to create the differential voltage.

Abstract: The present disclosure relates to a method of a non-volatile one time programmable memory (OTPM) including parallel programming of all banks of the OTPM by programming two rows per bank at a time, verifying the programming by comparing a first row of the two rows per bank, and verifying the programming by comparing a second row of the two rows per bank.

Abstract: The present disclosure relates to a structure which includes a twin-cell memory which is configured to program a plurality of write operations, a current sense amplifier which is connected to the twin-cell memory and is configured to sense a current differential and latch a differential voltage based on the current differential, and at least one current source which is connected to the current sense amplifier and is configured to add an offset current to the current sense amplifier to create the differential voltage.

Abstract: A latching current sensing amplifier circuit for memory arrays and a current sensing technique using the latching current sensing amplifier circuit are provided. The current sense-amplifier circuit includes a first and second pair of series connected transistors configured with a common gate node for a sense operation and reconfigurable as a cross-coupled pair for a latching operation.

Abstract: A latching current sensing amplifier circuit for memory arrays and a current sensing technique using the latching current sensing amplifier circuit are provided. The current sense-amplifier circuit includes a first and second pair of series connected transistors configured with a common gate node for a sense operation and reconfigurable as a cross-coupled pair for a latching operation.

Abstract: A latching current sensing amplifier circuit for memory arrays and a current sensing technique using the latching current sensing amplifier circuit are provided. The current sense-amplifier circuit includes a first and second pair of series connected transistors configured with a common gate node for a sense operation and reconfigurable as a cross-coupled pair for a latching operation.

Abstract: Approaches for a write assist circuit are provided. The write assist circuit includes a plurality of binary weighted boost capacitors which each contain a first node coupled to a bitline and a second node connected to a corresponding boost enabling transistor, and a plurality of boost enabling transistors which each contain a gate connected to a boost control enable signal for controlling a corresponding binary weighted boost capacitor. The boost control enable signal of each of the plurality of boost enabling transistors is controlled by encoded values based on a power supply level.

Abstract: An approach of operating a voltage pump system for a semiconductor chip. The approach includes one or more voltage pumps receiving a pair of clock signal inputs. The approach includes activating a first group of voltage pumps with a high clock signal level and activating a second group of voltage pumps activate with a low clock signal level. Furthermore, the approach includes deriving the pair of clock signal inputs from an oscillator and a hold circuit and configuring a current clock signal output level to latch upon receipt of a hold signal.

Abstract: A first data access request to a first row of a first memory array of the DRAM is received while a refresh operation in the first memory array is executing. The refresh operation is paused. The first data access request is executed, and simultaneously, the bits of the first row of the first memory array, including any updates indicated in the first data access request, are latched to a transfer register. The bits latched to the transfer register are written to a corresponding first row in a second memory array of the DRAM. A bank select logic is updated to indicate that subsequent data access requests to the first row in the first memory array will be executed from the second memory array. The refresh operation is then resumed.