Abstract: Methods and devices are provided for high-efficiency solar cells. In one embodiment, the device comprises of a solar cell having a high efficiency backside electrode configuration, wherein the solar cell comprises of: at least one transparent conductor, a photovoltaic layer, at least one bottom electrode, and at least one backside electrode. The device may include a plurality of electrical conduction fingers mounted to the transparent conductor in the solar cell. The device may include a plurality of filled vias coupled to the electrical conduction fingers, wherein the vias extend through the transparent conductor, the photovoltaic layer, and the bottom electrode, wherein the vias have a conductive core that conducts charge from the transparent conductor to the backside electrode. The via insulating layer may separate the conductive core in each via from the bottom electrode, wherein the insulating layer may be formed by a variety of techniques such as but not limited to aerosol coating of the via.

Abstract: Disclosed is a circuit element that includes a thermoplastic substrate and a conductive trace at least partially embedded in the thermoplastic substrate. Also disclosed is a method of forming a circuit element. The method includes the steps of providing a thermoplastic substrate having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace, and embedding the trace into the thermoplastic substrate by heating the thermoplastic substrate to a temperature above about the softening temperature about the trace.

Abstract: Disclosed is a circuit element that includes a thermoplastic substrate and a conductive trace at least partially embedded in the thermoplastic substrate. Also disclosed is a method of forming a circuit element. The method includes the steps of providing a thermoplastic substrate having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace, and embedding the trace into the thermoplastic substrate by heating the thermoplastic substrate to a temperature above about the softening temperature about the trace.

Abstract: An electrical circuit is provided with a substrate, preferably of synthetic polymer or coated paper, and an electrical circuit letterpress printed onto the substrate from ink comprising of electrical particles suspended in a resin. The resin may be an organic resin such as a soy resin, and the electrical particles may be electrically conductive such as metallic silver. The manufacture of conductors, resistors, capacitors and other electrical components is proposed. The circuit printing process is reliable and comparatively inexpensive and does not suffer from the inherent limitations of other additive printing processes.

Abstract: Disclosed is a circuit element including a substrate, a coating disposed on the substrate, and a conductive trace adjacent to the coating. The coating includes both pigment and hydrophobic binder. Also disclosed is a method for forming a circuit element. The method includes the steps of providing a substrate, disposing a coating that includes both a pigment and a hydrophobic binder on the substrate, and printing a conductive trace on the coating.

Abstract: Disclosed is a circuit element that includes a thermoplastic substrate and a conductive trace at least partially embedded in the thermoplastic substrate. Also disclosed is a method of forming a circuit element. The method includes the steps of providing a thermoplastic substrate having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace, and embedding the trace into the thermoplastic substrate by heating the thermoplastic substrate to a temperature above about the softening temperature about the trace.