Abstract: A monolithic cable assembly includes a communication cable and cable connectors coupled to either end of the communication cable. The communication cable includes at least one optical communication channel. The cable connectors include a physical end connector for electrically coupling to a data device connector, optoelectronic components for converting data signals between an electrical realm and an optical realm, and a passively aligned integrated lens cover. The integrated lens cover includes at least one optical pathway for coupling optical data signals between the at least one optical communication channel and the optoelectronic components.

Abstract: A transceiver is disclosed. The transceiver includes a carrier assembly having active components to transmit and receive optical input/output (I/O); and a connector, coupled to the carrier assembly to couple optical I/O between the active components and a waveguide.

Abstract: Methods of aligning lens carriers and ferrules with alignment frames during assembly of optical cable connectors are disclosed. In one aspect, a method may include coupling an alignment frame with a circuit substrate, aligning a lens carrier with the alignment frame, and aligning a ferrule with the alignment frame. Other methods, apparatus, and systems incorporating the apparatus are also disclosed.

Abstract: Methods of aligning lens carriers and ferrules with alignment frames during assembly of optical cable connectors are disclosed. In one aspect, a method may include coupling an alignment frame with a circuit substrate, aligning a lens carrier with the alignment frame, and aligning a ferrule with the alignment frame. Other methods, apparatus, and systems incorporating the apparatus are also disclosed.

Abstract: A monolithic cable assembly includes a communication cable and cable connectors coupled to either end of the communication cable. The communication cable includes at least one optical communication channel. The cable connectors include a physical end connector for electrically coupling to a data device connector, optoelectronic components for converting data signals between an electrical realm and an optical realm, and a passively aligned integrated lens cover. The integrated lens cover includes at least one optical pathway for coupling optical data signals between the at least one optical communication channel and the optoelectronic components.

Abstract: A parallel optics module including singulated dies. A first singulated die includes a first semiconductor optical component, and a second die includes a second semiconductor optical component. The first and second dies are mounted to a substrate. The first and second dies to be integrated into a parallel optics module.

Abstract: A method, apparatus, and system for implementing optical interconnects between high speed electrical interconnects by determining if an optical link exists between two optical transceivers, and if so, connecting input termination on the transmit input portion of each optical transceiver.

Abstract: Reverse bias leakage testing may be used to determine the health of a vertical cavity surface emitting laser (VCSEL). When VCSELs are integrated on a die with other electronic devices such testing may damage the other electronic devices or be prohibited by circuits on the die designed to protect the electronics from being reverse biased. Accordingly, reverse bias testing may be facilitated by providing a second ground pad, separate from the die ground pad, specific to the VCSEL.

Abstract: A connector is disclosed. The connector includes a floating component to receive a first set of optical waveguides, and a fixed component to receive a second set of optical waveguides and to facilitate optical alignment between the first set of waveguides and the second set of waveguides through automated alignments with the floating component.

Abstract: A parallel optics module including singulated dies. A first singulated die includes a first semiconductor optical component, and a second die includes a second semiconductor optical component. The first and second dies are mounted to a substrate. The first and second dies to be integrated into a parallel optics module.

Abstract: A parallel optics module including singulated dies. A first singulated die includes a first semiconductor optical component, and a second die includes a second semiconductor optical component. The first and second dies are mounted to a substrate. The first and second dies to be integrated into a parallel optics module.