Abstract: One aspect is an ablation system with a wire feed configured to feed a wire and a wire take-up configured to take-up the wire. A wire handling system is configured to advance the wire and to stop the wire between the wire feed and the wire take-up in a controlled manner. A laser ablation processor is located between the wire feed and the wire take-up, the laser ablation processor having at least one laser configured to ablate the wire when the wire is stopped. A clamp system is located between wire feed and the wire take-up and configured to clamp onto the wire when the wire is stopped.