Patents by Inventor Darren Young

Darren Young has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7888255
    Abstract: A first via opening is formed to a first conductor and a second via opening is formed to a second conductor. The first and second via openings are formed through insulative material. Then, the first conductor is masked from being exposed through the first via opening and to leave the second conductor outwardly exposed through the second via opening. An antifuse dielectric is formed within the second via opening over the exposed second conductor while the first conductor is masked. Then, the first conductor is unmasked to expose it through the first via opening. Then, conductive material is deposited to within the first via opening in conductive connection with the first conductor to form a conductive interconnect within the first via opening to the first conductor and to within the second via opening over the antifuse dielectric to form an antifuse comprising the second conductor, the antifuse dielectric within the second via opening and the conductive material deposited to within the second via opening.
    Type: Grant
    Filed: April 19, 2010
    Date of Patent: February 15, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Jasper Gibbons, Darren Young
  • Publication number: 20100203719
    Abstract: A first via opening is formed to a first conductor and a second via opening is formed to a second conductor. The first and second via openings are formed through insulative material. Then, the first conductor is masked from being exposed through the first via opening and to leave the second conductor outwardly exposed through the second via opening. An antifuse dielectric is formed within the second via opening over the exposed second conductor while the first conductor is masked. Then, the first conductor is unmasked to expose it through the first via opening. Then, conductive material is deposited to within the first via opening in conductive connection with the first conductor to form a conductive interconnect within the first via opening to the first conductor and to within the second via opening over the antifuse dielectric to form an antifuse comprising the second conductor, the antifuse dielectric within the second via opening and the conductive material deposited to within the second via opening.
    Type: Application
    Filed: April 19, 2010
    Publication date: August 12, 2010
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Jasper Gibbons, Darren Young
  • Patent number: 7713857
    Abstract: A first via opening is formed to a first conductor and a second via opening is formed to a second conductor. The first and second via openings are formed through insulative material. Then, the first conductor is masked from being exposed through the first via opening and to leave the second conductor outwardly exposed through the second via opening. An antifuse dielectric is formed within the second via opening over the exposed second conductor while the first conductor is masked. Then, the first conductor is unmasked to expose it through the first via opening. Then, conductive material is deposited to within the first via opening in conductive connection with the first conductor to form a conductive interconnect within the first via opening to the first conductor and to within the second via opening over the antifuse dielectric to form an antifuse comprising the second conductor, the antifuse dielectric within the second via opening and the conductive material deposited to within the second via opening.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: May 11, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Jasper Gibbons, Darren Young
  • Publication number: 20090239370
    Abstract: A first via opening is formed to a first conductor and a second via opening is formed to a second conductor. The first and second via openings are formed through insulative material. Then, the first conductor is masked from being exposed through the first via opening and to leave the second conductor outwardly exposed through the second via opening. An antifuse dielectric is formed within the second via opening over the exposed second conductor while the first conductor is masked. Then, the first conductor is unmasked to expose it through the first via opening. Then, conductive material is deposited to within the first via opening in conductive connection with the first conductor to form a conductive interconnect within the first via opening to the first conductor and to within the second via opening over the antifuse dielectric to form an antifuse comprising the second conductor, the antifuse dielectric within the second via opening and the conductive material deposited to within the second via opening.
    Type: Application
    Filed: March 20, 2008
    Publication date: September 24, 2009
    Inventors: Jasper Gibbons, Darren Young
  • Publication number: 20090008615
    Abstract: A roller chain and sprocket system utilizes an involute profile on the sprocket teeth to engage rollers in the links of a roller chain. The links, when aligned linearly, bear upon one another when pushed to form a substantially rigid column which has an axis. The system results in substantially 100% of the rotational energy imparted to the sprocket being translated into linear motion of the chain along the column axis.
    Type: Application
    Filed: June 9, 2008
    Publication date: January 8, 2009
    Applicant: HIGH ARCTIC ENERGY SERVICES LIMITED PARTNERSHIP
    Inventors: Darren YOUNG, Jed WOOD
  • Publication number: 20070262395
    Abstract: Planar access transistor devices and recessed access transistor devices used with semiconductor devices may include gate electrodes having materials with multiple work functions, materials that are electrically isolated from each other and supplied with two or more voltage supplies, or materials that create a diode junction within the gate electrode. Access device drivers are also provided which are capable of driving distinct or identical voltages to the gate electrodes.
    Type: Application
    Filed: May 11, 2006
    Publication date: November 15, 2007
    Inventors: Jasper Gibbons, Darren Young, Kunal Parekh, Casey Smith
  • Publication number: 20060054627
    Abstract: A paint tray including a mechanically-openable lid and a mechanism for opening the lid.
    Type: Application
    Filed: September 27, 2005
    Publication date: March 16, 2006
    Inventor: Darren Youngs