Abstract: A high density slider clamp fixture is disclosed for accurately positioning a large number of head sliders for metrology testing. The slider clamp fixture may include a single piece, monolithic structure comprising a large number of slider nests, aligned in rows and columns in the slider fixture. Each slider nest includes a reference datum surface machined to precisely align with all other reference datum surfaces in a row of the monolithic structure. Each slider nest further includes a flexure clamp for independent clamping of each slider in the row against the reference datum surfaces.

Abstract: A lapping mount tool and a process for lapping a row of head sliders involves affixing the row to a lapping mount tool fixture, actuating each of multiple first actuation pins to set each head slider for lapping to a respective element target stripe height, and simultaneously lapping accordingly. The process may further involve actuating each of multiple second actuation pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective angular force to a compliant elastomer adhered to the fixture and to the row, where such angular forces may be applied through at least two flexures interconnecting a rotatable first structural member and a second structural member of the lapping mount tool, wherein the flexures virtually intersect at and define an axis of rotation about which the angular forces are applied.

Abstract: A high density slider clamp fixture is disclosed for accurately positioning a large number of head sliders for metrology testing. The slider clamp fixture may include a single piece, monolithic structure comprising a large number of slider nests, aligned in rows and columns in the slider fixture. Each slider nest includes a reference datum surface machined to precisely align with all other reference datum surfaces in a row of the monolithic structure. Each slider nest further includes a flexure clamp for independent clamping of each slider in the row against the reference datum surfaces.

Abstract: A lapping tool assembly includes a mount tool and an interposer structure interposed between actuators and the mount tool, where the interposer includes interposer pins reactively coupled with the actuators such that each interposer pin is configured to receive a translational force from a corresponding actuator and to transmit the force to a corresponding actuation pin of the mount tool. The interposer may include a zero z-axis shift flexure system, and/or a z-axis decoupling flexure system, and/or alignment features, for accurately transmitting the actuation forces to the mount tool, while inhibiting affecting other portions of the mount tool.

Abstract: A high density slider clamp fixture is disclosed for accurately positioning a large number of head sliders for metrology testing. The slider clamp fixture may include a single piece, monolithic structure comprising a large number of slider nests, aligned in rows and columns in the slider fixture. Each slider nest includes a reference datum surface machined to precisely align with all other reference datum surfaces in a row of the monolithic structure. Each slider nest further includes a flexure clamp for independent clamping of each slider in the row against the reference datum surfaces.

Abstract: A high density slider clamp fixture is disclosed for accurately positioning a large number of head sliders for metrology testing. The slider clamp fixture may include a single piece, monolithic structure comprising a large number of slider nests, aligned in rows and columns in the slider fixture. Each slider nest includes a reference datum surface machined to precisely align with all other reference datum surfaces in a row of the monolithic structure. Each slider nest further includes a flexure clamp for independent clamping of each slider in the row against the reference datum surfaces.

Abstract: A lapping tool assembly includes a mount tool and an interposer structure interposed between actuators and the mount tool, where the interposer includes interposer pins reactively coupled with the actuators such that each interposer pin is configured to receive a translational force from a corresponding actuator and to transmit the force to a corresponding actuation pin of the mount tool. The interposer may include a zero z-axis shift flexure system, and/or a z-axis decoupling flexure system, and/or alignment features, for accurately transmitting the actuation forces to the mount tool, while inhibiting affecting other portions of the mount tool.

Abstract: A lapping mount tool and a process for lapping a row of head sliders involves affixing the row to a lapping mount tool fixture, actuating each of multiple first actuation pins to set each head slider for lapping to a respective element target stripe height, and simultaneously lapping accordingly. The process may further involve actuating each of multiple second actuation pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective angular force to a compliant elastomer adhered to the fixture and to the row, where such angular forces may be applied through at least two flexures interconnecting a rotatable first structural member and a second structural member of the lapping mount tool, wherein the flexures virtually intersect at and define an axis of rotation about which the angular forces are applied.

Abstract: A process for lapping a row of head sliders involves fixing the row to a lapping tool fixture, actuating each of multiple force pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective torque to a compliant elastomer between each force pin and corresponding head slider, to transfer a pressure gradient corresponding to the torque to the corresponding head slider. Such torques may be applied through at least two wedge angle flexures interconnecting a rotatable box structure and a fixed back wall of a lapping tool, wherein the flexures virtually intersect at and define an axis of rotation about which the torques are applied. The process may further involve actuating each force pin to set each head slider for lapping to a respective reader target stripe height, and simultaneously lapping accordingly.

Abstract: A process for lapping a row of head sliders involves fixing the row to a lapping tool fixture, actuating each of multiple force pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective torque to a compliant elastomer between each force pin and corresponding head slider, to transfer a pressure gradient corresponding to the torque to the corresponding head slider. Such torques may be applied through at least two wedge angle flexures interconnecting a rotatable box structure and a fixed back wall of a lapping tool, wherein the flexures virtually intersect at and define an axis of rotation about which the torques are applied. The process may further involve actuating each force pin to set each head slider for lapping to a respective reader target stripe height, and simultaneously lapping accordingly.

Abstract: Described herein is an apparatus, for processing semiconductor components, includes support surfaces and flexible couplings. The support surfaces are parallel to a first direction and spaced apart from each other in a second direction, perpendicular to the first direction. Moreover, the support surfaces are translationally movable relative to each other in the second direction to increase a pitch between adjacent support surfaces from a first pitch to a second pitch. Each of the flexible couplings is between and fixed to respective adjacent ones of the support surfaces. The flexible couplings flex as the support surfaces translationally move relative to each other in the second direction.

Abstract: A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module where the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure, thereby electrically connecting each ELG to the external circuit. A plurality of electrical connection pads may be deposited at the area at the end of the tape head module, and each electrical trace electrically connected to one of the pads, where electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit.

Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller such that the number of wire bonds from the controller to a row of read heads is minimized. When lapping the air bearing surface of the read heads, the electrical resistances of the ELGs are monitored to adjust the lapping process and set the stripe height for read sensors in the read heads. Once the resistance corresponds to the desired stripe height, the lapping process is stopped. To measure the resistance, each ELG may be electrically coupled to the same substrate—i.e., share the same common ground. The lapping controller applies a voltage potential across the ELGs using a wire bonded to a pad in the respective read head and one or more connections to the grounded substrate. This configuration avoids having to bond two wires onto each read head.

Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 ?m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.

Abstract: Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time.

Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller such that the number of wire bonds from the controller to a row of read heads is minimized. When lapping the air bearing surface of the read heads, the electrical resistances of the ELGs are monitored to adjust the lapping process and set the stripe height for read sensors in the read heads. Once the resistance corresponds to the desired stripe height, the lapping process is stopped. To measure the resistance, each ELG may be electrically coupled to the same substrate—i.e., share the same common ground. The lapping controller applies a voltage potential across the ELGs using a wire bonded to a pad in the respective read head and one or more connections to the grounded substrate. This configuration avoids having to bond two wires onto each read head.

Abstract: Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time.

Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 ?m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.

Abstract: A station for performing a lapping method to achieve tight dimension controls for both read and write elements of magnetic recording heads is disclosed. A recording head having a read head stripe height and a write head throat height is lapped using a plurality of lapping forces. At least one of the plurality of lapping forces includes a torque force. A lapping wedge angle is controlled using at least one torque force, which controls the offset between the recording head read head stripe height and the write head throat height.

Abstract: A slider lapping texture for implementation in a lapping environment. The slider lapping texture includes a lapping texture structure for utilization in a lapping process performed on a slider. The structure also includes a first surface having a base elevation. The structure further includes a second surface at an elevation higher than the base elevation. The second surface is for lapping the slider. The structure additionally includes an opening for expelling residue associated with a lapping process. The slider lapping texture is configured to generate an attractive force when the slider is motioned thereupon in a substantially unidirectional manner.