Patents by Inventor Darrin J. Haug

Darrin J. Haug has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Techniques for making a circuit board with improved impedance characteristics
    Patent number: 6909052
    Abstract: A circuit board has a first signal layer having a set of conductors, a second signal layer having a conductive plane and a non-conductive region, and a third signal layer having a conductive region that mirrors the non-conductive region of the second signal layer. The circuit board further includes a first separating layer having non-conductive material which is disposed between the first signal layer and the second signal layer, and a second separating layer having non-conductive material which is disposed between the second signal layer and the third signal layer. Accordingly, traces within the first signal layer and overlying the conductive plane of the second signal layer will have a first impedance, while traces within the first signal layer and overlying the non-conductive region of the second signal layer and the conductive region of the third signal layer will have a second impedance that is different than the first impedance.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: June 21, 2005
    Assignee: EMC Corporation
    Inventors: Darrin J. Haug, Brandon Barney