Patents by Inventor Darryl Becker
Darryl Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11864327Abstract: An inductor structure is provided that is positioned within a via of a printed circuit board. The inductor structure includes a via extending through a printed circuit board. The inductor structure includes at least one coil of an electrically conductive material beginning at a first opening to the via continuously present on a sidewall of the via encircling a center of the via extending to a second opening of the via opposite the first opening of the via. It further includes at least electrode present in contact with an end of the coil at said first or second opening.Type: GrantFiled: August 28, 2020Date of Patent: January 2, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gerald Bartley, Darryl Becker, Matthew Doyle, Mark Jeanson
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Publication number: 20230228824Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.Type: ApplicationFiled: March 23, 2023Publication date: July 20, 2023Inventors: Matthew Doyle, James Busby, Edward N. Cohen, John R. Dangler, Gerald Bartley, Michael Fisher, Arthur Higby, David Clifford Long, Mark J. Jeanson, Darryl Becker
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Patent number: 11652034Abstract: A method of attaching an integrated circuit (IC) package to a printed circuit board (PCB) with a set of direct current (DC) blocking capacitors includes: applying a conductive attachment material to a first set of attachment pads located on a first planar surface of the IC package; aligning the set of DC blocking capacitors in accordance with corresponding positions of the first set of attachment pads; attaching the set of DC blocking capacitors to the IC package by: positioning the aligned set of DC blocking capacitors so that a first surface of a first DC blocking capacitor of the set of DC blocking capacitors is adjacent to a corresponding attachment pad of the first set of attachment pads; and connecting the conductive attachment material to the IC package and to the first surface of the first DC blocking capacitor to create an IC package assembly.Type: GrantFiled: December 23, 2020Date of Patent: May 16, 2023Assignee: International Business Machines CorporationInventors: Darryl Becker, Mark J. Jeanson, Gerald Bartley, Matthew Doyle
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Patent number: 11614497Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.Type: GrantFiled: December 3, 2019Date of Patent: March 28, 2023Assignee: International Business Machines CorporationInventors: Matthew Doyle, James Busby, Edward N. Cohen, John R. Dangler, Gerald Bartley, Michael Fisher, Arthur Higby, David Clifford Long, Mark J. Jeanson, Darryl Becker
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Publication number: 20220284131Abstract: A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.Type: ApplicationFiled: March 2, 2021Publication date: September 8, 2022Inventors: Eric J. Campbell, Matthew Doyle, Mark J. Jeanson, Gerald Bartley, Darryl Becker
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Patent number: 11134562Abstract: An interconnect device may include a first center conductor of a first material that has a first durometer. The first center conductor may be surrounded by a first inner dielectric ring, which may be surrounded by a conductive region of a second material having a second durometer. The second durometer may be different from the first durometer. The conductive region may have a first end that defines a first plane and a second end that defines a second plane. An outer dielectric ring may surround the conductive region. The first center conductor may have a first bulb and a second bulb, the first bulb may extend in a direction away from the second plane and beyond the first plane, and the second bulb may extend in a direction away from the first plane and beyond the second plane.Type: GrantFiled: March 29, 2019Date of Patent: September 28, 2021Assignee: International Business Machines CorporationInventors: Matthew Doyle, Gerald Bartley, Darryl Becker, Mark J. Jeanson
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Publication number: 20210165051Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.Type: ApplicationFiled: December 3, 2019Publication date: June 3, 2021Inventors: Matthew Doyle, James Busby, Edward N. Cohen, John R. Dangler, Gerald Bartley, Michael Fisher, Arthur Higby, David Clifford Long, Mark J. Jeanson, Darryl Becker
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Publication number: 20210118784Abstract: A direct current (DC) blocking capacitor can be used with an integrated circuit (IC) package. The DC blocking capacitor can include a first electrically conductive planar surface having a first area and a second electrically conductive planar surface having a second area greater than the first area. The second planar surface is in a parallel planar orientation to the first planar surface. The DC blocking capacitor can also include a first set of electrically conductive plates electrically connected to the first planar surface and a second set of electrically conductive plates electrically connected to the second planar surface. The second set of electrically conductive plates is interleaved with and electrically insulated from the first set of electrically conductive plates by a dielectric material.Type: ApplicationFiled: December 23, 2020Publication date: April 22, 2021Inventors: Darryl Becker, Mark J. Jeanson, Gerald Bartley, Matthew Doyle
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Patent number: 10955568Abstract: Disclosed is a device for detecting non-intrusive inspections. The device includes an electrical component with a first end cap and a second end cap. Additionally, the device includes an x-ray sensitive material electrically coupling the first end cap and the second end cap. The x-ray sensitive material has a first state having a first conductivity and a second state having a second conductivity. The sensing material is configured to transform from the first state to the second state when exposed to an initiating voltage.Type: GrantFiled: February 8, 2019Date of Patent: March 23, 2021Assignee: International Business Machines CorporationInventors: Gerald Bartley, Matthew Doyle, Mark J. Jeanson, Darryl Becker
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Patent number: 10916493Abstract: A direct current (DC) blocking capacitor can be used with an integrated circuit (IC) package. The DC blocking capacitor can include a first electrically conductive planar surface having a first area and a second electrically conductive planar surface having a second area greater than the first area. The second planar surface is in a parallel planar orientation to the first planar surface. The DC blocking capacitor can also include a first set of electrically conductive plates electrically connected to the first planar surface and a second set of electrically conductive plates electrically connected to the second planar surface. The second set of electrically conductive plates is interleaved with and electrically insulated from the first set of electrically conductive plates by a dielectric material.Type: GrantFiled: November 27, 2018Date of Patent: February 9, 2021Assignee: International Business Machines CorporationInventors: Darryl Becker, Mark J. Jeanson, Gerald Bartley, Matthew Doyle
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Publication number: 20200396847Abstract: An inductor structure is provided that is positioned within a via of a printed circuit board. The inductor structure includes a via extending through a printed circuit board. The inductor structure includes at least one coil of an electrically conductive material beginning at a first opening to the via continuously present on a sidewall of the via encircling a center of the via extending to a second opening of the via opposite the first opening of the via. It further includes at least electrode present in contact with an end of the coil at said first or second opening.Type: ApplicationFiled: August 28, 2020Publication date: December 17, 2020Inventors: Gerald Bartley, Darryl Becker, Matthew Doyle, Mark Jeanson
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Patent number: 10834830Abstract: Creating in-via routing with a light pipe is disclosed. A resist layer is applied over a layer of conductive material provided in a via. A light pipe is inserted into the via. The surface of the light pipe includes at least one masked portion and at least one unmasked portion. A portion of the resist layer is exposed with light emitted from the unmasked portions of the light pipe. Portions of the conductive layer corresponding to the exposed portion of the resist layer are then removed to create the in-via routing.Type: GrantFiled: February 13, 2019Date of Patent: November 10, 2020Assignee: International Business Machines CorporationInventors: Mark J. Jeanson, Darryl Becker, Gerald Bartley, Matthew S. Doyle
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Patent number: 10834828Abstract: A method for forming passive electrical devices that includes depositing a photo reactive layer over a sidewall of a via that extends through a printed circuit board; inserting a light pipe having a mask configured to provide a passive electronic device geometry within the via to an entire depth of the via; and exposing the photo reactive layer to radiation provided by the light pipe to provide a pattern having the passive electronic device geometry on the sidewall of the via.Type: GrantFiled: January 26, 2018Date of Patent: November 10, 2020Assignee: International Business Machines CorporationInventors: Gerald Bartley, Darryl Becker, Matthew Doyle, Mark Jeanson
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Publication number: 20200314997Abstract: An interconnect device may include a first center conductor of a first material that has a first durometer. The first center conductor may be surrounded by a first inner dielectric ring, which may be surrounded by a conductive region of a second material having a second durometer. The second durometer may be different from the first durometer. The conductive region may have a first end that defines a first plane and a second end that defines a second plane. An outer dielectric ring may surround the conductive region. The first center conductor may have a first bulb and a second bulb, the first bulb may extend in a direction away from the second plane and beyond the first plane, and the second bulb may extend in a direction away from the first plane and beyond the second plane.Type: ApplicationFiled: March 29, 2019Publication date: October 1, 2020Inventors: Matthew Doyle, Gerald Bartley, Darryl Becker, Mark J. Jeanson
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Publication number: 20200257005Abstract: Disclosed is a device for detecting non-intrusive inspections. The device includes an electrical component with a first end cap and a second end cap. Additionally, the device includes an x-ray sensitive material electrically coupling the first end cap and the second end cap. The x-ray sensitive material has a first state having a first conductivity and a second state having a second conductivity. The sensing material is configured to transform from the first state to the second state when exposed to an initiating voltage.Type: ApplicationFiled: February 8, 2019Publication date: August 13, 2020Inventors: Gerald Bartley, Matthew Doyle, Mark J. Jeanson, Darryl Becker
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Publication number: 20200260594Abstract: Creating in-via routing with a light pipe is disclosed. A resist layer is applied over a layer of conductive material provided in a via. A light pipe is inserted into the via. The surface of the light pipe includes at least one masked portion and at least one unmasked portion. A portion of the resist layer is exposed with light emitted from the unmasked portions of the light pipe. Portions of the conductive layer corresponding to the exposed portion of the resist layer are then removed to create the in-via routing.Type: ApplicationFiled: February 13, 2019Publication date: August 13, 2020Inventors: MARK J. JEANSON, DARRYL BECKER, GERALD BARTLEY, MATTHEW S. DOYLE
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Patent number: 10712664Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.Type: GrantFiled: September 13, 2019Date of Patent: July 14, 2020Assignee: International Business Machines CorporationInventors: Gerald Bartley, Matthew Doyle, Darryl Becker, Mark Jeanson
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Publication number: 20200168535Abstract: A direct current (DC) blocking capacitor can be used with an integrated circuit (IC) package. The DC blocking capacitor can include a first electrically conductive planar surface having a first area and a second electrically conductive planar surface having a second area greater than the first area. The second planar surface is in a parallel planar orientation to the first planar surface. The DC blocking capacitor can also include a first set of electrically conductive plates electrically connected to the first planar surface and a second set of electrically conductive plates electrically connected to the second planar surface. The second set of electrically conductive plates is interleaved with and electrically insulated from the first set of electrically conductive plates by a dielectric material.Type: ApplicationFiled: November 27, 2018Publication date: May 28, 2020Inventors: Darryl Becker, Mark J. Jeanson, Gerald Bartley, Matthew Doyle
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Publication number: 20200004154Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.Type: ApplicationFiled: September 13, 2019Publication date: January 2, 2020Inventors: Gerald Bartley, Matthew Doyle, Darryl Becker, Mark Jeanson
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Patent number: 10481496Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.Type: GrantFiled: June 28, 2017Date of Patent: November 19, 2019Assignee: International Business Machines CorporationInventors: Gerald Bartley, Matthew Doyle, Darryl Becker, Mark Jeanson