Abstract: A memory controller configured to control a daisy chain of memory chips. The memory controller receives read and write requests from a processor, determines a daisy chain of memory chips that the request is directed to, determines which memory chip in the chain of memory chips the request is directed to, and transmits an address/command word recognizable by the correct memory chip. The memory controller sends write data words to the daisy chain of memory chips that can be associated by the correct memory chip for writing into the correct memory chip. The memory controller receives read data words from the daisy chain of memory chips and returns the read data to the processor. The memory controller transmits a bus clock to the daisy chain of memory chips for controlling transmission of address/command words and data words.

Abstract: A memory chip having a data bus having a plurality of bits. The number of bits is apportioned between a read portion and a write portion. The write portion is dedicated to receiving data that is to be written into an array on the memory chip; the read portion is dedicated to driving data that has been read from the array on the memory chip. The apportionment is programmable. Apportionment can be specified by programming signal pins on the memory chip, connecting the signal pins to appropriate logical values. The apportionment can alternatively be specified by scanning apportionment information into the memory chip at bring up time. The apportionment and also alternatively be specified by receiving apportionment information in an address/command word.

Abstract: A carrier having at least one memory chip in a daisy chain of memory chips. A first carrier has at least a portion of an entire daisy chain of memory chips attached to the first carrier. An address/command bus input on the first carrier carries an address/command word to a first memory chip in the daisy chain of memory chips. If the first memory chip determines that the address/command word is not directed to the first memory chip, the first memory chip re-drives the address/command word to a second memory chip in the daisy chain of memory chips using a point to point address/command bus link. If there are no more memory chips on the first carrier, the address/command word is re-driven to a memory chip on a second carrier.

Abstract: A particular chip is designed having a first variant (front side connected chip) of the chip and a second variant (back side connected chip). The first variant of the chip is attached to a carrier. The second variant of the chip is attached to the carrier inverted relative to the first variant of the chip. The first and second variants of the chip are attached to the carrier such that a vertical surface (side) of the first variant of the chip faces a corresponding vertical surface of the second variant of the chip. A circuit on the first variant of the chip is electrically connected to a corresponding circuit on the second variant of the chip.

Abstract: A memory controller for controlling a daisy chain of self timed memory chips. The memory controller has information as to how long each self timed memory chip in the daisy chain of memory chips takes to make a read access and a write access to an array on the self timed memory chip. The memory controller determines current access time information on a memory chip by sending a command to the memory chip. The memory chip returns a data word containing the current access time information. Alternatively, the memory controller transmits an address/command word to the memory chip and, after completing an access, transmits a responsive data word to the memory controller. The memory controller determines the access time information using the interval from transmission of the address/command word to reception of the responsive data word.

Abstract: A method and structure are provided for implementing component placement suspended within electrical pin grid array packages for enhanced electrical performance. A solder column grid array is coupled between a printed circuit board and a first level package. A component is connected between a predefined pair of adjacent columns in the solder column grid array suspended between the printed circuit board and the first level package.

Abstract: A memory system having a memory controller and a memory. The memory comprises one or more daisy chains of self timed memory chips. An address/command word is chained through a daisy chain of memory chips and is handled by one of the memory chips in the daisy chain of memory chips. Data to be written to a memory chip is sent as part of the address/command word, or is transferred on an outgoing data bus chain. Data read from a memory chip is transferred on an incoming data bus chain. Access timing on a memory chip is determined by a self time block on the memory chip.

Abstract: A self timed memory chip having an apportionable data bus. Access timing to an array on the memory chip is dynamically determined by circuitry on the memory chip. A ring oscillator on the memory chip has a frequency that is indicative of how fast an array on the memory chip can be accessed. The ring oscillator includes a bit line that is periodically charged and a memory element that subsequently discharges the bit line. The memory chip has a data bus interface having a number of bits. The data bus interface has a first number of bits apportioned to write data and a second number of bits apportioned to read data. The first number of bits and the second number of bits is programmable.

Abstract: Structures and a computer program product are provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations.

Abstract: A memory system having a memory controller and a daisy chain of memory chips. The memory controller is coupled to memory chips in the daisy chain of memory chips by an address/command bus chain. The memory controller is coupled to memory chips in the daisy chain of memory chips by a data bus chain having a number of data bus bits. The data bus chain has a first portion of data bus bits dedicated to transmitting write data from the memory controller to a memory chip. The data bus chain has a second portion of data bus bits dedicated to transmitting read data from a memory chip to the memory controller. Apportionment of data bus bits between the first portion and the second portion is programmable. Programming is done by pin connection, scanning of a value, or by request from a processor coupled to the memory controller.

Abstract: A memory chip suitable for use in a daisy chain of memory chips. The memory chip receives an address/command word on a first input, determines if the address command word is directed to the memory chip; if so, the memory chip accesses an array on the memory chip. If not, the memory chip re-drives the address/command word on a first output. Write data is received as part of the address/command word or from a first data bus port. A bus clock is received and is used to receive and transmit information on the first input, the first output, the first data bus port and the second data bus port. The memory chip is incorporated into a design structure that is embodied in a computer readable medium used for designing, manufacturing, or testing the memory chip.

Abstract: A method is provided for implementing vertically coupled noise control through a mesh plane in an electronic package design. Electronic package physical design data are received. Instances of vertically coupled noise in the electronic package physical design data are identified. The identified instances of vertically coupled noise are quantified. Then the electronic package physical design data are modified to limit the vertically coupled noise.

Abstract: A method is provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations.

Abstract: A method and apparatus implement redundant memory access using multiple controllers on the same bank of memory. A first memory controller uses the memory as its primary address space, for storage and fetches. A second redundant controller is also connected to the same memory. System control logic is used to notify the redundant controller of the need to take over the memory interface. The redundant controller initializes if required and takes control of the memory. The memory only needs to be initialized if the system has to be brought down and restarted in the redundant mode. This invention allows the system to continue to stay up and continue running during a memory controller or link failure.

Abstract: A method and apparatus implement redundant memory access using multiple controllers on the same bank of memory, and a design structure on which the subject circuit resides is provided. A first memory controller uses the memory as its primary address space, for storage and fetches. A second redundant controller is also connected to the same memory. System control logic is used to notify the redundant controller of the need to take over the memory interface. The redundant controller initializes if required and takes control of the memory. The memory only needs to be initialized if the system has to be brought down and restarted in the redundant mode. This invention allows the system to continue to stay up and continue running during a memory controller or link failure.

Abstract: A method, apparatus and computer program product are provided for implementing vertically coupled noise control through a mesh plane in an electronic package design. Electronic package physical design data are received. Instances of vertically coupled noise in the electronic package physical design data are identified. The identified instances of vertically coupled noise are quantified. Then the electronic package physical design data are modified to limit the vertically coupled noise.

Abstract: A heat sink apparatus having a plurality of chips attached to a first surface of a flexible carrier and a plurality of heat sink fins. One or more additional chips may be attached to a second surface of the flexible carrier. The flexible carrier has at least one complementary fold, the complementary fold having a counterclockwise fold and a clockwise fold as seen from the side. A first chip back surface of a first chip and a second chip back surface of a second chip are in thermal contact with a particular heat sink fin, that is, sharing the same heat sink fin. Thermal contact between the chips and heat sink fins is effected by force, by thermally conducting adhesive, by thermal grease, or by a combination of force and/or thermally conducting adhesive and/or thermal grease.

Abstract: A power control method and power control structures are provided for managing a plurality of voltage islands of a functional chip. The power control structure includes a supply control and partition chip positioned between a substrate carrier and a functional chip including a plurality of voltage islands. The supply control and partition chip includes a plurality of first electrical connections to the functional chip including the plurality of voltage islands. The supply control and partition chip includes a plurality of second electrical connections to the substrate carrier. Power applied to predefined ones of the first electrical connections to the functional chip are selectively switched on and off by the supply control and partition chip.

Abstract: Balanced wiring delay within an electronic package is implemented. A plurality of nets in a net group is identified in the electronic package. A predefined structure is added to each net within the group. A balanced wiring delay customizing program systematically processes and reduces length of the nets until a set length balance is obtained for the net group.

Abstract: A power control method and power control structures are provided for managing a plurality of voltage islands of a functional chip. The power control structure includes a supply control and partition chip positioned between a substrate carrier and a functional chip including a plurality of voltage islands. The supply control and partition chip includes a plurality of first electrical connections to the functional chip including the plurality of voltage islands. The supply control and partition chip includes a plurality of second electrical connections to the substrate carrier. Power applied to predefined ones of the first electrical connections to the functional chip are selectively switched on and off by the supply control and partition chip.