Patents by Inventor Darryl K. Smith

Darryl K. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5926944
    Abstract: An AC adapter for use with a portable computer has a primary transformer disposed within a plastic housing. A shielded heat sink assembly is positioned in the housing between the transformer and a facing interior side surface portion of the housing. The shielded heat sink assembly includes a resilient block of thermally conductive, high dielectric strength silicon material pressed into contact with a thermally conductive copper heat transfer band wrapped around the housing of the transformer. From its contact area with the copper band the silicon block extends through an opening in a black-colored plastic radiant shield sheet and is adhered to the inner side of a copper heat sink sheet with a thermally conductive adhesive material that also adheres the outer side of the plastic shield sheet to the inner side of the copper heat sink sheet. The outer side of the copper heat sink sheet is adhered to the facing interior side surface portion of the housing with thermally conductive adhesive material.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: July 27, 1999
    Assignee: Compaoq Computer Corporation
    Inventors: Darryl K. Smith, Alfred Faust
  • Patent number: 5726858
    Abstract: An AC adapter for use with a portable computer has a primary transformer disposed within a plastic housing. A shielded heat sink assembly is positioned in the housing between the transformer and a facing interior side surface portion of the housing. The shielded heat sink assembly includes a resilient block of thermally conductive, high dielectric strength silicon material pressed into contact with a thermally conductive copper heat transfer band wrapped around the housing of the transformer. From its contact area with the copper band the silicon block extends through an opening in a black-colored plastic radiant shield sheet and is adhered to the inner side of a copper heat sink sheet with a thermally conductive adhesive material that also adheres the outer side of the plastic shield sheet to the inner side of the copper heat sink sheet. The outer side of the copper heat sink sheet is adhered to the facing interior side surface portion of the housing with thermally conductive adhesive material.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: March 10, 1998
    Assignee: Compaq Computer Corporation
    Inventors: Darryl K. Smith, Alfred Faust
  • Patent number: 5134545
    Abstract: Using a specially designed isolation structure, a pair of relatively high voltage electrical components are mounted on a metal heat sink structure secured to a side edge portion of a printed circuit power supply board. The isolation structure includes an aluminum oxide insulating cradle member having a rectangular, plate-like body portion with an inner side secured to the heat sink, and an outer side on which a spaced pair of generally U-shaped external rib structures are formed. First portions of the components are received in the interiors of the rib structures, with the balance of each component projecting outwardly from its associated rib structure. A suitable clamping structure is used to press the received components against the underlying body portion of the cradle member.
    Type: Grant
    Filed: June 4, 1991
    Date of Patent: July 28, 1992
    Assignee: Compaq Computer Corporation
    Inventor: Darryl K. Smith