Patents by Inventor Darryl L. Becker

Darryl L. Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND STRUCTURE FOR DISPENSING CHIP UNDERFILL THROUGH AN OPENING IN THE CHIP
    Publication number: 20090079060
    Abstract: A method of making an integrated circuit package includes forming a through hole in an integrated circuit and assembling a die containing the integrated circuit on a carrier so that the die is mechanically and electrically connected to the carrier. Thereafter, an underfill material is dispensed between the die and the carrier via the through hole.
    Type: Application
    Filed: September 24, 2007
    Publication date: March 26, 2009
    Inventors: GERALD K. BARTLEY, Darryl L. Becker, Paul E. Dahlen, Philip R. Germann, Andrew B. Maki, Mark O. Maxson