Abstract: Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous “uphill” manner.

Abstract: Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous “uphill” manner.

Abstract: Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous “uphill” manner.

Abstract: Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous “uphill” manner.

Abstract: Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous “uphill” manner.

Abstract: Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous “uphill” manner.

Abstract: Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous “uphill” manner.

Abstract: A process is provided for forming spacers useful in large area displays. The process comprises steps of : forming bundles or boules comprising fiber strands which are held together with a binder; slicing the bundles or boules into slices; adhering the slices on an electrode plate of the display; and removing the binder. In the step of forming bundles or boules comprising fiber strands, the function of the binder is initially or fully performed by glass tubings surrounding the glass fibers. The clad glass of the envelopes etches more readily than the core glass.

Abstract: A process is provided for forming spacers useful in large area displays. The process comprises steps of: forming bundles or boules comprising fiber strands which are held together with a binder; slicing the bundles or boules into slices; adhering the slices on an electrode plate of the display; and removing the binder. In the step of forming bundles or boules comprising fiber strands, the function of the binder is initially or fully performed by glass tubings surrounding the glass fibers. The clad glass of the envelopes etches more readily than the core glass.

Abstract: A process is provided for forming spacers useful in large area displays. The process comprises steps of: forming bundles or boules comprising fiber strands which are held together with a binder; slicing the bundles or boules into slices; adhering the slices on an electrode plate of the display; and removing the binder. In the step of forming bundles or boules comprising fiber strands, the function of the binder is initially or fully performed by glass tubings surrounding the glass fibers. The clad glass of the envelopes etches more readily than the core glass.

Abstract: A field emission display (10) includes a substrate (12), a substantially inflexible dielectric layer (60) located on a portion of the substrate, the substrate having a first set of conductors (122) formed thereon at a first level and a second set of conductors (124) formed thereon at a second higher level; and a plurality of bond wire interconnects (126), individual bond wire interconnections extending between a selected conductor of the second higher level and a selected conductor of the first level.

Abstract: According to an aspect of the present invention, a process is provided for manufacturing a field emission display. In one embodiment, the process comprises disposing a self-dimensioning support member between a backplate assembly and a die assembly, and positioning the die assembly and the backplate assembly relative to each other such that the self-dimensioning support member is dimensioned relative to the distance between the assemblies.

Abstract: A method of forming ball bumps on a pad of a semiconductor die using aluminum wire is provided. The method includes providing an aluminum wire and a thermosonic ball bonding apparatus. The aluminum wire is held in a capillary tool of the ball bonding apparatus and a molten ball is formed on the wire using an electronic flame off (EFO). A forming gas comprising hydrogen and an inert gas, prevents the molten ball from oxidation hardening during formation thereof. Following formation, the molten ball is shaped into a ball bump by the capillary tool and then pressed against the pad while the capillary tool is vibrated. The completed die can be bonded to a substrate pad on a supporting substrate by using a bonding technique such as flip chip bonding, chip on glass bonding, chip on flex bonding, TAB bonding, and z-axis adhesive bonding.

Abstract: A process is provided for forming spacers useful in large area displays. The process comprises steps of: forming bundles or boules comprising fiber strands which are held together with a binder; slicing the bundles or boules into slices; adhering the slices on an electrode plate of the display; and removing the binder. In the step of forming bundles or boules comprising fiber strands, the function of the binder is initially or fully performed by glass tubings surrounding the glass fibers. The clad glass of the envelopes etches more readily than the core glass.

Abstract: A method for manufacturing hollow spacers includes forming an elongated tube from sheets of material, and then separating a transverse segment of a desired thickness from the tube to form a spacer. For forming spacers for a field emission display, the sheets can be glass and the adhesive can be glass frit paste. The tube can be segmented by attaching the assembled tube to a support piece and then saw cutting the tube.

Abstract: A flat-panel field emission display comprises a luminescent faceplate, a rigid backplate, and an interposed or sandwiched emitter or cathode plate. A dielectric connector ridge is screen-printed over the faceplate's rear surface. Upper and lower level conductors are then screen printed over the faceplate. The lower-level conductors are applied directly on the faceplate rear surface. The upper-level conductors are applied atop the connector ridge. A plurality of bond wire interconnections extend between individual screen-printed conductors of the upper and lower levels. The bond wire interconnections create inter-level electrical interconnections between said individual screen-printed conductors. The cathode plate is positioned over the connector ridge. The cathode plate has a plurality of die bond pads facing the faceplate rear surface and aligned with the upper-level conductors.

Abstract: A flat-panel field emission display comprises a luminescent faceplate, a rigid backplate, and an interposed or sandwiched emitter or cathode plate. A dielectric connector ridge is screen-printed over the faceplate's rear surface. Upper and lower level conductors are then screen printed over the faceplate. The lower-level conductors are applied directly on the faceplate rear surface. The upper-level conductors are applied atop the connector ridge. A plurality of bond wire interconnections extend between individual screen-printed conductors of the upper and lower levels. The bond wire interconnections create inter-level electrical interconnections between said individual screen-printed conductors. The cathode plate is positioned over the connector ridge. The cathode plate has a plurality of die bond pads facing the faceplate rear surface and aligned with the upper-level conductors.

Abstract: According to an aspect of the present invention, a process is provided for manufacturing a field emission display. In one embodiment, the process comprises disposing a self-dimensioning support member between a backplate assembly and a die assembly, and positioning the die assembly and the backplate assembly relative to each other such that the self-dimensioning support member is dimensioned relative to the distance between the assemblies.

Abstract: A method for forming an electrical connection between a semiconductor die and a corresponding electrical component mounted within an electrical device is provided. The method includes wire bonding metal wires to the bond pads of the die and then severing the metal wires to form loose leads attached to the bond pads. With the die mounted to the electrical device, the loose leads are bonded to the electrical component using a bonding tip. In an illustrative embodiment, the electrical device is a field emission display package and the electrical component is conductive traces for the package. Advantageous, the method can be used to form the electrical connection between the die mounted in a sealed space and the corresponding electrical component which is outside of the sealed space.

Abstract: A flat-panel field emission display comprises a luminescent faceplate, a rigid backplate, and an interposed or sandwiched emitter or cathode plate. A dielectric connector ridge is screen-printed over the faceplate's rear surface. Upper and lower level conductors are then screen printed over the faceplate. The lower-level conductors are applied directly on the faceplate rear surface. The upper-level conductors are applied atop the connector ridge. A plurality of bond wire interconnections extend between individual screen-printed conductors of the upper and lower levels. The bond wire interconnections create inter-level electrical interconnections between said individual screen-printed conductors. The cathode plate is positioned over the connector ridge. The cathode plate has a plurality of die bond pads facing the faceplate rear surface and aligned with the upper-level conductors.