Patents by Inventor Darshak R. Desai

Darshak R. Desai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hot melt adhesive composition and use thereof
    Patent number: 11306226
    Abstract: The sprayable olefin-based hot melt adhesive and absorbent articles comprising the adhesive are disclosed. The sprayable olefin-based hot melt adhesive is particularly suitable for spraying at low application temperatures. The sprayable low application temperature hot melt adhesives have high green strength, excellent bond strength and aging performance. Moreover, the sprayable low application temperature hot melt adhesives allows for thin bond lines without bleed-through and burn-through risks for heat-sensitive substrates.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: April 19, 2022
    Assignee: Henkel AG & Co. KGaA
    Inventors: Yuhong Hu, Darshak R. Desai, Jinyu Chen, Matthew L. Sharak
  • HOT MELT ADHESIVE COMPOSITION AND USE THEREOF
    Publication number: 20180002579
    Abstract: The sprayable olefin-based hot melt adhesive and absorbent articles comprising the adhesive are disclosed. The sprayable olefin-based hot melt adhesive is particularly suitable for spraying at low application temperatures. The sprayable low application temperature hot melt adhesives have high green strength, excellent bond strength and aging performance. Moreover, the sprayable low application temperature hot melt adhesives allows for thin bond lines without bleed-through and burn-through risks for heat-sensitive substrates.
    Type: Application
    Filed: September 19, 2017
    Publication date: January 4, 2018
    Inventors: Yuhong HU, Darshak R. DESAI, Jinyu CHEN, Matthew L. Sharak
  • Hot melt adhesive
    Patent number: 7208541
    Abstract: A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: April 24, 2007
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Lie-zhong Gong, Melissa L. Allen, Justin A. Mehaffy, Darshak R. Desai, Dale L. Haner, Tuyet Le