Abstract: An adapter for adapting a first circuit package to a second circuit packaging, includes a substrate for receiving the first circuit package thereon, a plurality of connectors disposed on the substrate configured in the form of the second circuit packaging, and interconnections on the substrate for interconnecting the first circuit package to the plurality of connectors. At least one electronic component may also be disposed on the substrate and interconnected with the first transceiver package and the second transceiver packaging. An insulator pad may be provided for electrically insulating the adapter circuitry from an electrical system circuit board on which the adapter is mounted. A metal cover provides a chassis ground.