Patents by Inventor Daryl A. Sato

Daryl A. Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for printed circuit board conductor channeling
    Publication number: 20030061590
    Abstract: A system and method of embedding conductor channels into a printed circuit board. These conductor channels are used to provided increase power to circuits on the printed circuit board, provide shielding for these circuits and provide communications for these circuits. These conductor channels are created by ablating dielectric layers in the printed circuit board and depositing a conductive material therein.
    Type: Application
    Filed: September 26, 2001
    Publication date: March 27, 2003
    Inventors: David W. Boggs, Rebecca Jessep, Carolyn McCormick, Daryl Sato
  • Arrangement of vias in a substrate to support a ball grid array
    Publication number: 20030057974
    Abstract: An arrangement of vias for mounting a semiconductor package on a substrate. In order to strengthen the soldered bonds, standard vias, which have a stronger bond, are used in locations of greatest stress and deflection. Vias in pad (VIP) are used at all other locations to improve routing advantages due to their smaller surface area.
    Type: Application
    Filed: September 26, 2001
    Publication date: March 27, 2003
    Inventors: Carolyn McCormick, Rebecca Jessep, John Dungan, David W. Boggs, Daryl Sato
  • Coupon registration mechanism and method
    Publication number: 20030056365
    Abstract: A registration coupon is provided for a printed circuit board or other substrate. The registration coupon may be used to determine a hole-to-outer layer feature registration and a solder mask registration. The registration coupon may include a registration hole provided on the circuit board, a metal pad and an anti-pad provided on the circuit board about the registration hole, and a solder mask covering the metal pad.
    Type: Application
    Filed: September 26, 2001
    Publication date: March 27, 2003
    Inventors: David W. Boggs, Rebecca A. Jessep, Carolyn McCormick, Daryl A. Sato, John H. Dungan
  • Grid array mounting arrangements
    Publication number: 20030047348
    Abstract: Grid array mounting arrangements, including apparatus (sub-arrays, arrays, electronic components, systems) and methods.
    Type: Application
    Filed: September 10, 2001
    Publication date: March 13, 2003
    Inventors: Rebecca Jessep, Ray Askew, Daryl Sato, Jeff Krieger, Phil Geng