Patents by Inventor Daryl James Nelson

Daryl James Nelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6666705
    Abstract: A first aspect of the invention is an electrical connector that includes a housing formed to include first and second opposing ends and an elongated slot between the ends. The slot receives a connective edge of a printed circuit card. Closely spaced contacts located in the slot engage conductive pads on the printed circuit card. A first alignment member is formed integrally at the first end of the housing, to engage a non-polarized keyway during insertion of the printed circuit card into the elongated slot, aligning the printed circuit card relative to the contacts. A second aspect of the invention is the keying of the printed circuit card along a connective edge. The connective edge includes two connective regions which define a polarized keyway between the two connective regions. A third, non-connective, region located at one end of the connective regions defines a non-polarized keyway between the connective regions and the non-connective region.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: December 23, 2003
    Assignee: Intel Corporation
    Inventors: Jeff Lauruhn, Daryl James Nelson
  • Patent number: 6285078
    Abstract: An apparatus and method for protecting the various components of a microprocessor is provided. The apparatus includes a thermal spreader cap that is disposed between the processor die and thermal plate, and the OLGA and thermal plate. Thermal grease layers are also provided between the thermal spreader cap and the thermal plate, the thermal spreader cap and the processor die, and the thermal spreader cap and the OLGA. The apparatus provides a compliant assembly that protects the processor die from damage due to shock and/or vibration. It also provides multiple thermal paths along which heat generated by the various components of the microprocessor may be removed, and therefore allows for a higher performance processor.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: September 4, 2001
    Assignee: Intel Corporation
    Inventor: Daryl James Nelson
  • Patent number: 6130819
    Abstract: A modular cooling apparatus for computer systems is disclosed. The apparatus includes an air-guiding duct, a fan coupling to the duct and a coupling apparatus for coupling the air-guiding duct and the fan to an electronics housing. The air-guiding duct has an input opening to the exterior of the electronics housing and guides ambient outside air to the input of the fan. Then the fan directs this outside air to the inside of the electronics housing. The electronic housing can be formed between a base module and the computer system circuit board or between the air-guiding duct, fan and a retention module. Furthermore, outside air is delivered in a substantially perpendicular direction relative to the plane of the computer system circuit board within the electronics housing.
    Type: Grant
    Filed: January 29, 1998
    Date of Patent: October 10, 2000
    Assignee: Intel Corporation
    Inventors: Steve Lofland, Daryl James Nelson, Lloyd L. Pollard, II, James Stacker Webb, Scott L. Noble
  • Patent number: 5912802
    Abstract: A device and method for cooling an integrated circuit package--in particular, a microprocessor--within an enclosed computer system. The device comprises a blower, a first heat sink attached to the microprocessor, and a first air duct coupling the blower to the first heat sink. The blower has an air intake from the exterior of the computer system. The blower generates an air stream which flows through the first air duct to the first heat sink for cooling the first microprocessor. A second air duct connected to the first heat sink may be used to subsequently direct the air stream to a second heat sink for cooling a second microprocessor. An efficient ducted heat sink for use in this cooling system can be easily constructed by attaching two extruded heat sinks.
    Type: Grant
    Filed: September 11, 1997
    Date of Patent: June 15, 1999
    Assignee: Intel Corporation
    Inventor: Daryl James Nelson
  • Patent number: 5784263
    Abstract: A printed circuit board retention system for supporting printed circuit boards in a computer chassis consists of a mother board located in the computer chassis and having a mother board connector mounted to it for connecting to a daughter card. The mother board connector has attachment points molded into it for optionally fastening a base support member. A daughter card including an edge card connection along the bottom edge for mating with the mother board connector such that the daughter card is positioned substantially at right angles to the mother board. A separate base support member may be fastened to the mother board by attachment points that mechanically mate with the attachment points on the mother board connector. The base support member has upwardly extending arms with clips on the ends. A partial frame element has downwardly extending arms with clips at the end that mate with the clips on the base support member arms.
    Type: Grant
    Filed: January 8, 1996
    Date of Patent: July 21, 1998
    Assignee: Intel Corporation
    Inventor: Daryl James Nelson