Abstract: Embodiments of the invention include an accelerometer system. The system includes an accelerometer sensor comprising first and second electrode configurations and an inertial mass between the first and second electrode configurations. In one example, the accelerometer sensor being fabricated as symmetrically arranged about each of three orthogonal mid-planes. The system also includes an accelerometer controller configured to apply control signals to each of the first and second electrode configurations to provide respective forces to maintain the inertial mass at a null position between the first and second electrode configurations. The accelerometer controller can measure a first pickoff signal and a second pickoff signal associated with the respective first and second electrode configurations. The first and second pickoff signals can be indicative of a displacement of the inertial mass relative to the null position.

Abstract: Embodiments of the invention include an accelerometer system. The system includes an accelerometer sensor comprising first and second electrode configurations and an inertial mass between the first and second electrode configurations. In one example, the accelerometer sensor being fabricated as symmetrically arranged about each of three orthogonal mid-planes. The system also includes an accelerometer controller configured to apply control signals to each of the first and second electrode configurations to provide respective forces to maintain the inertial mass at a null position between the first and second electrode configurations. The accelerometer controller can measure a first pickoff signal and a second pickoff signal associated with the respective first and second electrode configurations. The first and second pickoff signals can be indicative of a displacement of the inertial mass relative to the null position.

Abstract: In one implementation, a chamber is selected that accommodates an array of die structures that comprises one or more cavities. An inner chamber of the chamber is maintained at a first temperature. An alkali metal source of the chamber is maintained at a second temperature greater than the first temperature. An outer chamber of the chamber is maintained at a third temperature greater than the first temperature and the second temperature. The one or more cavities of the array of die structures are filled with a portion of the alkali metal source. The one or more cavities of the array of die structures are sealed to comprise the portion of the alkali metal source.

Abstract: In one implementation, a chamber is selected that accommodates an array of die structures that comprises one or more cavities. An inner chamber of the chamber is maintained at a first temperature. An alkali metal source of the chamber is maintained at a second temperature greater than the first temperature. An outer chamber of the chamber is maintained at a third temperature greater than the first temperature and the second temperature. The one or more cavities of the array of die structures are filled with a portion of the alkali metal source. The one or more cavities of the array of die structures are sealed to comprise the portion of the alkali metal source.

Abstract: An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.

Abstract: An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.

Abstract: The fiber jacket application system is used to provide a protective jacket over spliced optical fibers (10, 12), such as to coat a length of bare fiber, previously coated fiber, and particularly to rejacket a length of fiber in which the jacket was removed for splicing. Curable jacketing material is twice fed from a reservoir (28) through a small orifice or syringe (32) onto the respective sides of bared portions (10d, 12d) of the fiber. A first material (14) is deposited from and between the existing jackets (10a, 12a) and onto essentially half of the bared portions. A second material (16) is deposited in bonded contact with the first applied material from and between the surrounding protective jackets and onto essentially the remaining half of the bared portions.

Abstract: An input optical fiber (22), an output optical fiber (24, 26) and a waveguide (14) in an integrated optic chip (IOC) (12) intermediate the fibers are coupled together using service and alignment robots (42; 48, 50, 52). The service robot (42) establishes the three dimensional position of the waveguide. The alignment robots (48, 50, 52) three dimensionally and angularly align the input and output fibers respectively to the input and output legs (16; 18, 20) of the waveguide. An adhesive applying tool (46) coupled with the service robot adheres the input and output fibers respectively to their waveguide input and output legs.

Abstract: An integrated accelerometer includes features for minimizing the effects of foreseeable operational stresses. The accelerometer is of a type that includes a planar support base having an internal aperture for accommodating a hinged strut and limit stops for minimizing the travel of the shadow paddle portion of the strut. The limit stops are fabricated of material of suitable spring constant to provide an appropriate degree of "give" without degrading instrument performance or accuracy. Two-piece arrangements sandwich the hinges, thereby limiting flexure to an acceptable range. The predictable mechanical stresses resulting, for example, from thermal coefficient mismatches between the materials of the torquer coil and the strut are minimized by the use of a spacer intermediate the base and the coil.

Abstract: An integrated accelerometer includes features for minimizing the effects of foreseeable operational stresses. The accelerometer is of a type that includes a planar support base having an internal aperture for accommodating a hinged strut and limit stops for minimizing the travel of the shadow paddle portion of the strut. The limit stops are fabricated of material of suitable spring constant to provide an appropriate degree of "give" without degrading instrument performance or accuracy. Two-piece arrangements sandwich the hinges, thereby limiting flexure to an acceptable range. The predictable mechanical stresses resulting, for example, from thermal coefficient mismatches between the materials of the torquer coil and the strut are minimized by the use of a spacer intermediate the base and the coil.

Abstract: An integrated accelerometer includes features for minimizing the effects of foreseeable operational stresses. The accelerometer is of a type that includes a planar support base having an internal aperture for accommodating a hinged strut and limit stops for minimizing the travel of the shadow paddle portion of the strut. The limit stops are fabricated of material of suitable spring constant to provide an appropriate degree of "give" without degrading instrument performance or accuracy. Two-piece arrangements sandwich the hinges, thereby limiting flexure to an acceptable range. The predictable mechanical stresses resulting, for example, from thermal coefficient mismatches between the materials of the torquer coil and the strut are minimized by the use of a spacer intermediate the base and the coil.