Patents by Inventor Daryl Purcell

Daryl Purcell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • AIRGAP STRUCTURES FOR HIGH SPEED SIGNAL INTEGRITY
    Publication number: 20210375746
    Abstract: Processes and structures resulting therefrom for the improvement of high speed signaling integrity in electronic substrates of integrated circuit packages, which is achieved with the formation of airgap structures within dielectric material(s) between adjacent conductive routes that transmit/receive electrical signals, wherein the airgap structures decrease the capacitance and/or decrease the insertion losses in the dielectric material used to form the electronic substrates.
    Type: Application
    Filed: May 27, 2020
    Publication date: December 2, 2021
    Applicant: INTEL CORPORATION
    Inventors: Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo, Brandon C. Marin, Zhiguo Qian, Daryl Purcell, Leonel Arana, Matthew Tingey