Patents by Inventor Daryl Quake Chin Wern

Daryl Quake Chin Wern has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages and modules with integrated ferrite material
    Patent number: 9852928
    Abstract: A semiconductor package includes a lead frame having a die paddle and a plurality of leads including a gate lead spaced apart from the die paddle. The semiconductor package further includes a semiconductor die attached to the die paddle and having a plurality of pads including a gate pad, a plurality of electrical conductors connecting the pads to the leads, an encapsulant encasing the semiconductor die and a portion of the leads such that part of the leads are not covered by the encapsulant, and a ferrite material embedded in the encapsulant and surrounding a portion of the electrical conductor that connects the gate pad to the gate lead. A method of manufacturing the semiconductor package and a semiconductor module with integrated ferrite material are also provided.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: December 26, 2017
    Assignee: Infineon Technologies AG
    Inventors: Charles Low Khai Yen, Daryl Quake Chin Wern
  • Semiconductor Packages and Modules with Integrated Ferrite Material
    Publication number: 20160099189
    Abstract: A semiconductor package includes a lead frame having a die paddle and a plurality of leads including a gate lead spaced apart from the die paddle. The semiconductor package further includes a semiconductor die attached to the die paddle and having a plurality of pads including a gate pad, a plurality of electrical conductors connecting the pads to the leads, an encapsulant encasing the semiconductor die and a portion of the leads such that part of the leads are not covered by the encapsulant, and a ferrite material embedded in the encapsulant and surrounding a portion of the electrical conductor that connects the gate pad to the gate lead. A method of manufacturing the semiconductor package and a semiconductor module with integrated ferrite material are also provided.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 7, 2016
    Inventors: Charles Low Khai Yen, Daryl Quake Chin Wern