Patents by Inventor Daryl R. Wilde

Daryl R. Wilde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package with multiple sides having package contacts
    Patent number: 6815254
    Abstract: A semiconductor package assembly 10 has an intervening package (12) that may be connected to a first package (14) from a first substrate (20) on a first side of the package (12) and to a second package (13) from a second substrate (53) on a second, opposing side of the package (12). Electrical contact to a semiconductor die (32) is made from the first side by wire bonding to wire bond posts (26) and by balls (46, 48) from the second side. Electrical contact from one side of the intervening package (12) to the other may be made by bypassing the die. Electrical contact on either side of the intervening package may be made both within and outside the footprint of the semiconductor die (32).
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: November 9, 2004
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Addi B. Mistry, Joseph M. Haas, Dennis O. Kiffe, James H. Kleffner, Daryl R. Wilde
  • Semiconductor package with multiple sides having package contacts
    Publication number: 20040178499
    Abstract: A semiconductor package assembly 10 has an intervening package (12) that may be connected to a first package (14) from a first substrate (20) on a first side of the package (12) and to a second package (13) from a second substrate (53) on a second, opposing side of the package (12). Electrical contact to a semiconductor die (32) is made from the first side by wire bonding to wire bond posts (26) and by balls (46, 48) from the second side. Electrical contact from one side of the intervening package (12) to the other may be made by bypassing the die. Electrical contact on either side of the intervening package may be made both within and outside the footprint of the semiconductor die (32).
    Type: Application
    Filed: March 10, 2003
    Publication date: September 16, 2004
    Inventors: Addi B. Mistry, Joseph M. Haas, Dennis O. Kiffe, James H. Kleffner, Daryl R. Wilde