Dasheng Mo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: An earphone is provided, and includes a housing, a loudspeaker, and a noise cancellation microphone, the housing comprises an internal space, and a sound pickup channel. The noise cancellation microphone is connected to the communication surface by the sound pickup channel. The housing comprises an outer housing and a frame, the housing is provided with the internal space and a communication hole, and the frame is provided with a communication surface facing the communication hole. The communication surface comprises a sound-emitting hole and a sound pickup hole, the sound-emitting hole and the sound pickup hole are isolated from each other, and the sound-emitting hole is connected to the front cavity. The sound pickup channel and the front cavity are isolated from each other through the frame.
Type:
Grant
Filed:
December 18, 2021
Date of Patent:
September 2, 2025
Assignee:
Huawei Technologies Co., Ltd.
Inventors:
Tienan Zhang, Haibo Shan, Yan Li, Dasheng Mo
Abstract: An earphone is provided, and includes a housing, a loudspeaker, and a noise cancellation microphone, the housing comprises an internal space, and a sound pickup channel. The noise cancellation microphone is connected to the communication surface by the sound pickup channel. The housing comprises an outer housing and a frame, the housing is provided with the internal space and a communication hole, and the frame is provided with a communication surface facing the communication hole. The communication surface comprises a sound-emitting hole and a sound pickup hole, the sound-emitting hole and the sound pickup hole are isolated from each other, and the sound-emitting hole is connected to the front cavity. The sound pickup channel and the front cavity are isolated from each other through the frame.
Type:
Application
Filed:
December 18, 2021
Publication date:
March 28, 2024
Inventors:
Tienan Zhang, Haibo Shan, Yan Li, Dasheng Mo