Abstract: An optical beam splitter includes an input waveguide, two or more branching arms, two or more fan-out arms, and two or more output waveguides. The input waveguide receives an input light beam. The two or more branching arms are coupled to the input waveguide at a separation point and split the input light beam at the separation point into two or more light beams. Each fan-out arm is coupled to one of the branching arms and fans-out one of the two or more light beams to a predetermined output pitch. Each output waveguide is coupled to one of the fan-out arms and transmits one of the two or more light beams out of the optical beam splitter.

Abstract: An optical modulator includes an input waveguide, a splitting point, a first interaction arm of length L1, a second interaction arm of length L2 that is unequal in length to the first interaction arm, a recombination point, and an output waveguide. The splitting point receives an incoming continuous wave light beam comprising two or more wavelengths of light from the input waveguide and splits it into a first light beam and a second light beam. The first interaction arm is coupled to the input waveguide and transports the first light beam. The second interaction arm is coupled to the input waveguide and transports the second light beam. The output waveguide is coupled to the first interaction arm and second interaction arm at the recombination point and combines the first light beam and second light beam into an output modulated light beam. The first interaction arm and the second interaction arm comprise an electro-optic material with a refractive index that changes according to a modulation stimulus.

Abstract: Disclosed are optical modulators that provide high-speed modulation capability and compact size. In exemplary modulator embodiments, the branch waveguide cores are formed in different processing layers than the input waveguide core, and light is coupled from an input waveguide core to two branch waveguide cores along diagonal directions. The construction enables the input waveguide core to be made of low-loss material compared to the electro-optic material of the branch waveguide cores. Also disclosed are interconnect apparatuses that can be used in processing systems. Exemplary interconnect apparatuses provide various configurations of components that enable high-speed modulation and compact size. The exemplary interconnect apparatuses may use the exemplary optical modulators disclosed herein.

Abstract: A method for creating an integrated linear polarizer is provided. An electro-optical component is fabricated and may include a bottom electrode, a bottom cladding layer, side cladding features, an electro-optic polymer layer, a top cladding layer, and a top electrode. After fabrication, the electro-optical component is poled to create or enhance polarization properties of the electro-optic polymer layer. The electro-optical component may be heated to at least a first threshold temperature. An electric field may then be applied to the electro-optical component. In the presence of the electric field, the electro-optical component may be cooled to at or below a second threshold temperature that is less than the first threshold temperature. Once the electro-optical component has cooled to the second threshold temperature, the electric field may be removed.

Abstract: A method for creating an integrated linear polarizer is provided. An electro-optical component is fabricated and may include a bottom electrode, a bottom cladding layer, side cladding features, an electro-optic polymer layer, a top cladding layer, and a top electrode. After fabrication, the electro-optical component is poled to create or enhance polarization properties of the electro-optic polymer layer. The electro-optical component may be heated to at least a first threshold temperature. An electric field may then be applied to the electro-optical component. In the presence of the electric field, the electro-optical component may be cooled to at or below a second threshold temperature that is less than the first threshold temperature. Once the electro-optical component has cooled to the second threshold temperature, the electric field may be removed.

Abstract: An integrated electro-optic module may contain a continuous layer of electro-optic polymer through both a splitter portion and a modulator portion in order to facilitate high speed data transmission. The integrated electro-optic module may be fabricated by depositing a bottom cladding layer on a wafer, creating side cladding features, depositing the electro-optic polymer, and coating with a top cladding layer. The electro-optic polymer in both the splitter portion and modulator portion of the integrated electro-optic module may create inverted-ridge waveguide structures. The waveguide in the splitter portion may have a first ridge depth, and the waveguide in the modulator portion may have a second ridge depth, the first ridge depth greater than the second ridge depth.

Abstract: Disclosed are optical modulators that provide high-speed modulation capability and compact size. In exemplary modulator embodiments, the branch waveguide cores are formed in different processing layers than the input waveguide core, and light is coupled from an input waveguide core to two branch waveguide cores along diagonal directions. The construction enables the input waveguide core to be made of low-loss material compared to the electro-optic material of the branch waveguide cores. Also disclosed are interconnect apparatuses that can be used in processing systems. Exemplary interconnect apparatuses provide various configurations of components that enable high-speed modulation and compact size. The exemplary interconnect apparatuses may use the exemplary optical modulators disclosed herein.

Abstract: The present invention provides an improved thin film write head and method of fabrication capable of providing an ultra-short yoke and/or an ultra-low conductor winding stack. The present invention reduces yoke length and stack height by forming the conductor winding in a trench etched from an insulation layer, preferably formed of an inorganic insulation material. A thin resist mask is used to define the width of the trench while the etch process defines the depth. Preferably, the insulation layer is formed on a different inorganic insulation material to control the etch process, thus, the conductor winding may be formed on the underlying layer. The conductor winding preferably is formed by depositing conductor material so that it fills the trench and then planarizing, such as by chemical mechanical polish, to remove conductor material deposited outside the trench.

Abstract: The present invention provides an improved thin film write head and method of fabrication capable of providing an ultra-short yoke and/or an ultra-low conductor winding stack. The present invention reduces yoke length and stack height by forming the conductor winding in a trench etched from an insulation layer, preferably formed of an inorganic insulation material. A thin resist mask is used to define the width of the trench while the etch process defines the depth. Preferably, the insulation layer is formed on a different inorganic insulation material to control the etch process, thus, the conductor winding may be formed on the underlying layer. The conductor winding preferably is formed by depositing conductor material so that it fills the trench and then planarizing, such as by chemical mechanical polish, to remove conductor material deposited outside the trench.

Abstract: A chemical mechanical cleaning method utilizes an ammonium persulphate solution with simultaneous mechanical brushing to remove residual slurry particles from copper surfaces. The pH of the solution is selected to electrostatically repel charged slurry particles from the copper surface.