Patents by Inventor Dat Quach

Dat Quach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE FOR PROCESSING A MICROELECTRONIC SUBSTRATE, AND RELATED METHODS
    Publication number: 20230360672
    Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 9, 2023
    Inventors: Zubair Ahmed Khan, Dat Quach, Andrew Habermas, Joel William Hoehn
  • Adhesive for processing a microelectronic substrate, and related methods
    Patent number: 11749300
    Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: September 5, 2023
    Assignee: Seagate Technology LLC
    Inventors: Zubair Ahmed Khan, Dat Quach, Andrew Habermas, Joel William Hoehn
  • Lapping system that includes a lapping plate temperature control system, and related methods
    Patent number: 11305397
    Abstract: The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/?5° C., or even +/?0.5° C.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: April 19, 2022
    Assignee: Seagate Technology LLC
    Inventors: Andrew Habermas, Dat Quach, Jeff O'Konski, Yuhong Xiong, Ricky Anderson, Joshua Zierhut
  • ADHESIVE FOR PROCESSING A MICROELECTRONIC SUBSTRATE, AND RELATED METHODS
    Publication number: 20200090687
    Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.
    Type: Application
    Filed: October 23, 2019
    Publication date: March 19, 2020
    Inventors: Zubair Ahmed Khan, Dat Quach, Andrew Habermas, Joel William Hoehn
  • LAPPING SYSTEM THAT INCLUDES A LAPPING PLATE TEMPERATURE CONTROL SYSTEM, AND RELATED METHODS
    Publication number: 20190381628
    Abstract: The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/?5° C., or even +/?5° C.
    Type: Application
    Filed: June 4, 2019
    Publication date: December 19, 2019
    Inventors: Andrew Habermas, Dat Quach, Jeff O'Konski, Yuhong Xiong, Ricky Anderson, Joshua Zierhut
  • Adhesive for processing a microelectronic substrate, and related methods
    Patent number: 10465099
    Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: November 5, 2019
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Zubair Ahmed Khan, Dat Quach, Andrew Habermas, Joel William Hoehn
  • METHOD OF SYNTHESIS COBALT ANTIMONIDE NANOSCALE STRUCTURES AND DEVICE
    Publication number: 20110220166
    Abstract: This invention pertains generally to compositions and a method for making films, nanostructures and nanowires in templates and on substrates, including but not limited to metal-semiconductor nanostructures and semiconductor nanostructures on semiconductor substrates, and a device having the same. Particularly described are methods for making cobalt antimonide nanostructures on gold and Co—Sb substrates.
    Type: Application
    Filed: March 3, 2011
    Publication date: September 15, 2011
    Inventors: Ruxandra Vidu, Dat Quach, Pieter Stroeve