Abstract: An electronic cabinet is described which contains both control circuits containing heat producing components and a plurality of circuit breakers. The control circuits and the circuit breakers are located inside the cabinet with heat dissipating fins being located outside of the cabinet in a heat dissipating chimney. Air moves through the chimney by convection and cooperates with the heat dissipating fins to dissipate most of the heat generated by the heat-generating components of the control circuits. Openings are provided in the cabinet to permit cooling air to pass through the interior of the cabinet and over the control circuit components. These two paths of cooling air cooperate to reduce the temperature in the cabinet to a sufficient level to permit the circuit breakers to be located in the same chamber as the control circuits.

Abstract: A mounting structure is disclosed for mounting a semiconductor device on a conductive heat sink while electrically insulating the two. A thin, flat thermally conductive electrically insulative sheet is disposed between a flat electrically conductive surface of the semiconductor device and the flat electrically conductive surface of the heat sink which is to receive the semiconductor device. The semiconductor device is fixed to the insulation sheet by a first electrically conductive rivet which compresses the two together. The opening in the insulation sheet through which the rivet passes is enlarged so that no radial forces are applied to the sheet by expansion of the rivet. The rivet head on the bottom of the insulation sheet extends into an enlarged opening in the underlying heat sink but does not touch the opening.