Patents by Inventor Davar I. Roshanagh

Davar I. Roshanagh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonding connector and method
    Patent number: 5426266
    Abstract: A connection for mounting an IC die directly to a substrate includes circuit runs deposited on the substrate with bond pad portions having metallization patterns forming ridges and cutout areas. Metal bumps made of gold or other highly conductive malleable material are placed atop the metallization patterns and are forced into the cutout areas between ridges as the dies are compressed onto the substrate. This locks the dies to the circuit run bond pads so as to resist thermal stress and high humidity.
    Type: Grant
    Filed: November 8, 1993
    Date of Patent: June 20, 1995
    Assignee: Planar Systems, Inc.
    Inventors: Candice H. Brown, Davar I. Roshanagh