Patents by Inventor Dave Culbertson

Dave Culbertson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor component and semiconductor component thereof
    Patent number: 6475834
    Abstract: A method of manufacturing a semiconductor component includes coupling a clip bond (230) from a semiconductor chip (120) to a lead frame (110) and dividing the clip bond into at least first and second portions separated from each other.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: November 5, 2002
    Assignee: Semiconductor Components Industries LLC
    Inventors: Saat Shukri Embong, Dave Culbertson, Chee Hiong Chew
  • Method of manufacturing a semiconductor component and semiconductor component thereof
    Publication number: 20020066962
    Abstract: A method of manufacturing a semiconductor component includes coupling a clip bond (230) from a semiconductor chip (120) to a lead frame (110) and dividing the clip bond into at least first and second portions separated from each other.
    Type: Application
    Filed: December 4, 2000
    Publication date: June 6, 2002
    Applicant: Semiconductor Components Industries, LLC
    Inventors: Saat Shukri Embong, Dave Culbertson, Chee Hiong Chew