Abstract: An independently automated mechanical transplanter for dispensing seedlings into a furrow located in the ground or in a field. The transplanter includes at least one automated transplanter unit mounted to a transportable frame. A trundle is mounted to the transportable frame having a plurality of gripper fingers. Each automated transplanter unit has a seedling tray for presenting a plurality of seedlings to the trundle to grip and extract the seedlings from the seedling tray. The transplanter also includes a moveable conveyor belt having a plurality of pockets attached thereto; the trundle configured to transfer the plurality of seedlings into the plurality of pockets as the conveyor belt moves; and each individual pocket configured to open when positioned directly over a delivery chute for dropping the seedlings into a planting shoe for delivery into the open furrow.

Abstract: An independently automated mechanical transplanter for dispensing seedlings into a furrow located in the ground or in a field. The transplanter includes at least one automated transplanter unit mounted to a transportable frame. A trundle is mounted to the transportable frame having a plurality of gripper fingers. Each automated transplanter unit has a seedling tray for presenting a plurality of seedlings to the trundle to grip and extract the seedlings from the seedling tray. The transplanter also includes a moveable conveyor belt having a plurality of pockets attached thereto; the trundle configured to transfer the plurality of seedlings into the plurality of pockets as the conveyor belt moves; and each individual pocket configured to open when positioned directly over a delivery chute for dropping the seedlings into a planting shoe for delivery into the open furrow.

Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.