Abstract: The composite ceiling can have a shell made of a polymer-based material and defining a plurality of internal compartments, having a flat and smooth under surface spaced apart from a flooring and facing the flooring, and an upper surface opposite the under surface, a first layer of rebars having a first plurality of rebars spaced apart from one another along the depth of the shell, the first layer of rebars being separated from upper surface by spacers, a second layer of rebars having a second plurality of rebars spaced apart from one another along the width of the shell, the second layer of rebars being above the first layer of rebars, and a horizontally extending concrete slab extending over the shell and surrounding the rebars.

Abstract: Systems, apparatuses, and methods for generating an on-line/eCommerce based garment viewing, selection, and sizing service that includes a virtual shopping experience capable of being initiated by activating an embedded uniform resource locator (URL) from an arbitrary web-based application or browser. The inventive system includes elements and processes that may be used to generate realistic images and behavior of a user's digital facsimile and associated clothing and/or accessories under different environmental viewing conditions (such as lighting, shading, etc.). These elements and processes may include mathematical/computational models of fabric appearance at both larger and smaller scales, fabric motion under conditions of wind or movement of a person wearing a garment, fabric reflectivity, garment seams, stylistic elements, etc.

Abstract: An apparatus and technique for performing continuity tests of power and ground pins on a packaged integrated circuit. The technique includes using a first and second fanout circuit each including a number of signal paths. Each signal path includes a switch and corresponds to a power or ground socket on a board configured to hold a number of integrated circuit packages. The fanout circuits allow full device testing, as well as testing of individual pins. By controlling the state of the switches, power and ground may be selectively supplied to power and ground pins to check the continuity of the signals from the integrated circuit device within the package to the external pins provided to route the signal to an external device.

Abstract: An apparatus and technique for performing continuity tests of power and ground pins on a packaged integrated circuit. The technique includes using a first and second fanout circuit each including a number of signal paths. Each signal path includes a switch and corresponds to a power or ground socket on a board configured to hold a number of integrated circuit packages. The fanout circuits allow full device testing, as well as testing of individual pins. By controlling the state of the switches, power and ground may be selectively supplied to power and ground pins to check the continuity of the signals from the integrated circuit device within the package to the external pins provided to route the signal to an external device.