Abstract: An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include a plurality of fin components that dissipate thermal energy integrated into a heatsink base and a plurality of radio frequency antenna portions coupled to and surrounded by the fin components. The plurality of radio frequency antenna portions may form a monopole antenna. The heatsink base may operate as a ground reference for each of the plurality of the antenna portions and to improve an omnidirectional pattern of each of the plurality of the antenna portions.

Abstract: An agent is installed on a computing device of a vehicle (e.g., an ECU); the agent receives messages from an application installed on the same computing device. The computing device is connected to a gateway computing device via a physical communication channel (e.g., CAN bus or Ethernet cable). When the gateway agent receives a message from the application, it converts the message into a different protocol based on a mapping of the protocols to physical communication channels. The message is sent to a gateway agent at the gateway device, where it is converted back to the original protocol so the message can be processed/transmitted to the internet. By using an agent, the in-vehicle application does not need to know about the vehicle's network architecture or changes to it in order to access the internet.

Abstract: An automotive interior door panel having a decorative covering displayed to the interior compartment of a vehicle and a rigid substrate having a backing surface. The backing surface includes a plurality of energy absorbers integrally molded thereon. The method utilizing the following steps. A low-pressure or high pressure injection mold operable between open and closed positions is moved to the open position. The mold has a covering receiving surface and an energy absorber producing surface. A flexible covering is positioned juxtaposed the covering receiving surface. The mold is moved to the closed position to create a space between the covering and the energy absorber producing surface. A molten plastic material is injected into the space to form the door substrate. The substrate has a nominal cross-sectional thickness between said energy absorbers.