Abstract: A modular blending system is shown and described. The modular blending system may include a storage device capable of storing a plurality of flavoring products, and an ice shaving mechanism removably attached to the storage device, the ice shaving mechanism including an ice dispenser. The modular blending system may also include a fluid dispensing unit in fluid communication with the flavoring products, where the fluid dispensing unit is separate from the ice dispenser.

Abstract: A process for fabricating a semiconductor device which includes forming a collimated metal layer (54) on the surface of a semiconductor substrate (24), while maintaining the temperature of the substrate preferably below about 100.degree. C., and most preferably below about 25.degree. C. The collimated metal layer (54) is formed by directing a stream of metal atoms through a collimator (18) and onto the surface of the substrate (24). The temperature of the substrate (24) is controlled by supplying a heat transfer fluid from a temperature control system (26) to a vacuum chuck (14) supporting the semiconductor substrate (24). The collimated metal layer (54) is comprised of metal atoms having predominantly a (002) crystallographic orientation. The uniform crystallographic orientation of the collimated metal layer (54) can be used to effect the formation of additional metal layers (58, 62) having uniform crystallographic orientation.