Patents by Inventor Dave Reichle

Dave Reichle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus of testing memory device power and ground pins in an array assembly platform
    Patent number: 6545497
    Abstract: An apparatus and technique for performing continuity tests of power and ground pins on a packaged integrated circuit. The technique includes using a first and second fanout circuit each including a number of signal paths. Each signal path includes a switch and corresponds to a power or ground socket on a board configured to hold a number of integrated circuit packages. The fanout circuits allow full device testing, as well as testing of individual pins. By controlling the state of the switches, power and ground may be selectively supplied to power and ground pins to check the continuity of the signals from the integrated circuit device within the package to the external pins provided to route the signal to an external device.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: April 8, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Dave Hebert, Dave Remmerden, Dave Reichle, Gary Chadwick
  • Method and apparatus of testing memory device power and ground pins in an array assembly platform
    Publication number: 20020132382
    Abstract: An apparatus and technique for performing continuity tests of power and ground pins on a packaged integrated circuit. The technique includes using a first and second fanout circuit each including a number of signal paths. Each signal path includes a switch and corresponds to a power or ground socket on a board configured to hold a number of integrated circuit packages. The fanout circuits allow full device testing, as well as testing of individual pins. By controlling the state of the switches, power and ground may be selectively supplied to power and ground pins to check the continuity of the signals from the integrated circuit device within the package to the external pins provided to route the signal to an external device.
    Type: Application
    Filed: March 15, 2001
    Publication date: September 19, 2002
    Inventors: Dave Hebert, Dave Remmerden, Dave Reichle, Gary Chadwick